On constrained sintering—I. Constitutive model for a sintering body

Bordia, Rajendra K.; Scherer, George W.

doi:10.1016/0001-6160(88)90189-7

Cited by 336 publications

(249 citation statements)

References 15 publications

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“…[28][29][30][31] The presence of non-sintering reinforcement particles retards the sintering rate of a conventional powder compact. In the present case, the constraint of the Z40A and Z80A powders with a heating rate of 10 K/min.…”

Section: (1) Metastability In Spray-pyrolyzed Zro -Al Omentioning

confidence: 99%

Dense Amorphous Zirconia–Alumina by Low‐Temperature Consolidation of Spray‐Pyrolyzed Powders

Gandhi

Jayaram

1999

Journal of the American Ceramic Society

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Section: (1) Metastability In Spray-pyrolyzed Zro -Al Omentioning

confidence: 99%

Dense Amorphous Zirconia–Alumina by Low‐Temperature Consolidation of Spray‐Pyrolyzed Powders

Gandhi

Jayaram

1999

Journal of the American Ceramic Society

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“…A theory for constrained sintering based on viscous constitutive deformation equations was developed by Bordia and Scherer [10,11]. The relationship between the densification rate for a constrained film, constr ρ & , and the unconstrained material, free ρ& , is given by…”

Section: Introductionmentioning

confidence: 99%

Constrained sintering kinetics of 3YSZ films

Kim

Rudkin

Wang

et al. 2011

Journal of the European Ceramic Society

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“…Here, a viscous model for stress analysis is applied. [13][14][15][16] As shown in Fig. 3, the principal stresses and principal strains generated in a unit cell Cell(x, y, z) of the paste are (r x , r y , r z ) and (e x , e y , e z ), respectively.…”

Section: B Viscous Model For Stress Analysismentioning

confidence: 99%

A diffusion-viscous analysis and experimental verification of defect formation in sintered silver bond-line

2014

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The low-temperature joining technique (LTJT) by silver sintering is being implemented by major manufacturers of power electronic devices and modules for bonding power semiconductor chips. A common die-attach material used with LTJT is a silver paste consisting of silver powder (micrometer-or nanometer-sized particles) mixed in organic solvent and binder formulation. It is believed that the drying of the paste during the bonding process plays a critical role in determining the quality of the sintered bond-line. In this study, a model based on the diffusion of solvent molecules and viscous mechanics of the paste was introduced to determine the stress and strain states of the silver bond-line. A numerical simulation algorithm of the model was developed and coded in the C11 programming language. The numerical simulation allows determination of the time-dependent physical properties of the silver bond-line as the paste is being dried with a heating profile. The properties studied were solvent concentration, weight loss, shrinkage, stress, and strain. The stress is the cause of cracks in the bond-line and bond-line delamination. The simulated results were verified by experiments in which the formation of bond-line cracks and interface delamination was observed during the pressure-free drying of a die-attach nanosilver paste. The simulated results were consistent with our earlier experimental findings that the use of uniaxial pressure of a few mega-Pascals during the drying stage of a nanosilver paste was sufficient to produce high-quality sintered joints. The insight offered by this modeling study can be used to develop new paste formulations that enable pressure-free, low-temperature sintering of the die-attach material to significantly lower the cost of implementing the LTJT in manufacturing.

show abstract

On constrained sintering—I. Constitutive model for a sintering body

Cited by 336 publications

References 15 publications

Dense Amorphous Zirconia–Alumina by Low‐Temperature Consolidation of Spray‐Pyrolyzed Powders

Dense Amorphous Zirconia–Alumina by Low‐Temperature Consolidation of Spray‐Pyrolyzed Powders

Constrained sintering kinetics of 3YSZ films

A diffusion-viscous analysis and experimental verification of defect formation in sintered silver bond-line

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