On the elastic and creep stress analysis modeling in the oxide scale/metal substrate system due to oxidation growth strain

Ruan, J.L.; Pei, Yongmao; Fang, Daining

doi:10.1016/j.corsci.2012.09.035

Cited by 22 publications

(3 citation statements)

References 46 publications

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“…11). The curvature of the materials would generate both axial and tangential stresses 35 , which signi cantly in uences both the oxidation rate and the morphology of the oxide layer [36][37][38][39] . These tensile stresses are found along the axial direction and compressive stresses are along the tangential direction.…”

Section: The Second Oxidation Pathway Of Tinmentioning

confidence: 99%

Unraveling the atomic structure evolution of titanium nitride upon oxidation

Li,

Hao,

Miao

et al. 2024

Preprint

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Oxidation-induced structural failure is a major issue in high-strength non-oxide ceramics, yet the atomic-level structural changes underlying phase transformation have remained elusive. Here, we present a study that employs state-of-the-art aberration-corrected environmental transmission electron microscopy to unravel the atomic-scale structural evolution of titanium nitride during dynamic oxidation. Our findings reveal two distinct reaction pathways, each characterized by the migration of titanium atoms through the formation of chains of titanium vacancies and staggered titanium vacancies. We demonstrate that these pathways are significantly influenced by both crystal orientation and surface curvature. Our rigorous First-principles calculations elucidate the underlying mechanism, revealing that titanium atoms have the highest kinetics for moving out along the {200} family, while their movement is modulated by surface strain involved in curvature changes. This insight is further substantiated by macroscopic oxidation experiments, affirming that the precision control of material orientation indeed enhances antioxidative performance. Our research holds immense scientific and technological significance, advancing our understanding of materials' antioxidation performance and ultimately bolstering durability and extending lifespan.

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Section: The Second Oxidation Pathway Of Tinmentioning

confidence: 99%

Unraveling the atomic structure evolution of titanium nitride upon oxidation

Li,

Hao,

Miao

et al. 2024

Preprint

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“…McCartney predicted the through‐thickness crack and the spallation of oxide scale subjected to tensile stress on cooling. Meanwhile, several experimental studies found that the oxide creep played a critical role on the stress state and the oxide failure behavior . In addition, the physical defect formed in oxide has been determined as the key factor that influenced the oxide failure behavior .…”

Section: Introductionmentioning

confidence: 99%

Numerical simulation of the failure behavior of steam‐side oxide scale considering oxide creep and physical defects

Jing

Zhou

Huang

et al. 2017

Materials & Corrosion

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The present study deals with a numerical simulation of the failure behavior of steam‐side oxide scale at high temperature considering oxide creep and physical defects. An experimental observation was conducted on the oxide scale formed on T91 superheater tubes from one coal‐fired plant, and the elastic‐plastic finite element model (FEM) considering oxide creep was established to predict the crack load and the residual stress within oxide scale during cooling. The simulation results associated with those of the pure elastic model were used to clarify the effect of oxide creep on oxide failure. Then the FEM was applied to assess the occurrence of oxide failure as a function of physical defect length, oxide thickness, and cooling rate. The results showed that the hold period on cooling could effectively prevent oxide spallation. Interestingly, the influence of physical defect length on the through‐scale crack was larger than the interface crack, while the cooling rate and oxide thickness had a more significant effect on the interface crack.

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“…Then the variations of oxide stress and scale thickness along with time can be obtained by combining Eqs. (10)- (12), (19), (22) and (24).…”

Section: Equilibrium Condition Due To Constant Strainmentioning

confidence: 99%

Coupled mechanical-oxidation modeling during silicon thermal oxidation process

Zhang

2015

AIP Advances

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This work provided an analytical model to solve the coupled mechanical-oxidation problem during the silicon thermal oxidation process. The silicon thermal oxidation behavior under two different mechanical load conditions, i.e., constant strain and uniaxial stress, were considered. The variations of oxide stress and scale thickness along with oxidation time were predicted. During modeling, all the effects of stress accumulation due to growth strain, stress relaxation due to viscous flow and the external load on the scale growth rate were taken into consideration. Results showed that the existence of external loads had an obvious influence on the oxide stress and scale thickness. Generally, tensile stress or strain accelerated the oxidant diffusion process. However, the reaction rate at the Si/SiO2 interface was retarded under uniaxial stress, which was not found in the case of constant strain load.

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On the elastic and creep stress analysis modeling in the oxide scale/metal substrate system due to oxidation growth strain

Cited by 22 publications

References 46 publications

Unraveling the atomic structure evolution of titanium nitride upon oxidation

Unraveling the atomic structure evolution of titanium nitride upon oxidation

Numerical simulation of the failure behavior of steam‐side oxide scale considering oxide creep and physical defects

Coupled mechanical-oxidation modeling during silicon thermal oxidation process

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