Open failure mechanisms of FCBGA package under temperature cycling stress

Chen, Xuanlong; Cheng, Jing; Wu, Huiwei; Liu, Liyuan

doi:10.1109/ipfa.2017.8060207

Cited by 3 publications

(1 citation statement)

References 7 publications

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“…After 1000 cycles, many cracks were found in the center of the bonding interface, which indicated that mechanical fatigue after thermal cycling was the main reason for the initial cracks. Under the thermal cycling condition, Chen et al [ 64 ] investigated the delamination crack failure mechanism of UBM (Under Bump Metallurgy) and low-k inner layer dielectric (ILD) in FCBGA packages under temperature cycling conditions. The results show that the thermal stress caused by the CTE mismatch of different interface materials is the main reason ( Figure 8 ).…”

Section: Delamination Mechanism At the Two-phase Interfacementioning

confidence: 99%

Delamination of Plasticized Devices in Dynamic Service Environments

Tian,

Chen,

Zhang

et al. 2024

Micromachines

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With the continuous development of advanced packaging technology in heterogeneous semiconductor integration, the delamination failure problem in a dynamic service environment has gradually become a key factor limiting the reliability of packaging devices. In this paper, the delamination failure mechanism of polymer-based packaging devices is clarified by summarizing the relevant literature and the latest research solutions are proposed. The results show that, at the microscopic scale, thermal stress and moisture damage are still the two main mechanisms of two-phase interface failure of encapsulation devices. Additionally, the application of emerging technologies such as RDL structure modification and self-healing polymers can significantly improve the thermal stress state of encapsulation devices and enhance their moisture resistance, which can improve the anti-delamination reliability of polymer-based encapsulation devices. In addition, this paper provides theoretical support for subsequent research and optimization of polymer-based packages by summarizing the microscopic failure mechanism of delamination at the two-phase interface and introducing the latest solutions.

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Section: Delamination Mechanism At the Two-phase Interfacementioning

confidence: 99%