Optical quality study of refractive lenses made out of oxide glass using hot embossing

Kasztelanic, Rafał; Kujawa, Ireneusz; Ottevaere, Heidi; Pysz, Dariusz; Stępień, Ryszard; Thienpont, Hugo; Buczyński, Ryszard

doi:10.1016/j.infrared.2015.09.024

Cited by 4 publications

(1 citation statement)

References 14 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Generally, the hot-embossing glass-microlens cycle is long due to its long cooling time to eliminate thermal stress [27]. A hexagonal-microlens array was fabricated via a precise thermal-mechanical embossing process, but the time of the glass-embossing process reached 138 min with cooling time of 88 min [28].…”

Section: Introductionmentioning

confidence: 99%

Theoretical and Experimental Study on Hot-Embossing of Glass-Microprism Array without Online Cooling Process

Xie

et al. 2020

Micromachines

View full text Add to dashboard Cite

Optical glass-microprism arrays are generally embossed at high temperatures, so an online cooling process is needed to remove thermal stress, but this make the cycle long and its equipment expensive. Therefore, the hot-embossing of a glass-microprism array at a low strain rate with reasonable embossing parameters was studied, aiming at reducing thermal stress and realizing its rapid microforming without online cooling process. First, the flow-field, strain-rate, and deformation behavior of glass microforming were simulated. Then, the low-cost microforming control device was designed, and the silicon carbide (SiC) die-core microgroove array was microground by the grinding-wheel microtip. Lastly, the effect of the process parameters on forming rate was studied. Results showed that the appropriate embossing parameters led to a low strain rate; then, the trapezoidal glass-microprism array could be formed without an online cooling process. The standard deviation of the theoretical and experimental forming rates was only 7%, and forming rate increased with increasing embossing temperature, embossing force, and holding duration, but cracks and adhesion occurred at a high embossing temperature and embossing force. The highest experimental forming rate reached 66.56% with embossing temperature of 630 °C, embossing force of 0.335 N, and holding duration of 12 min.

show abstract

Section: Introductionmentioning

confidence: 99%