Optical Response in the Photoselective Metal Deposition (PSMD) Imaging System

Abstract

The optical response of a representative PSMD imaging system, stannous chloride sensitized polyimide film, was determined by exposing sensitized substrates to ultraviolet radiation and measuring the resulting decrease in catalytic activity for electroless copper deposition. This activity was determined by measuring light transmission through the deposited metal and substrate.The imaging reaction photoresponse was measured in the 200–400 nm wavelength range. The sensitivity was found greatest at 200 nm, decreasing monotonically with wavelength. The upper limit for useful imaging in air occurred in the vicinity of 350 nm. The imaging reaction rate was also found proportional to I0.7 , where I is the incident Tight intensity. This intensity dependence was found over the entire range of measured wavelengths. An explanation of the system's optical behavior in terms of light‐generated electronhole pairs is offered.

Controlled Deposition of Tin Oxide and Silver Nanoparticles Using Microcontact Printing

“…The maximum surface height of the film with respect to the underlying glass surface (Figure 3d) is 7 nm, comparable to the size of SnOx nanoparticles observed in other studies [7,8,27]. This implies that the stamped sensitizer film on glass is made up of roughly a monolayer of SnOx nanoparticles.…”

“…Dissolved oxygen in such solutions partially oxidizes the Sn 2+ producing its hydrated oxides that ripen by the sol-gel process to form SnOx (x < 2) nanoparticles. Unfortunately, the formation of complex oxychlorides, oxides of mixed Sn oxidation states, and the influence of dissolved oxygen on its colloidal structure [5,7,8] prevent monitoring of the growth, or even determination of the chemical composition of the SnOx particles in solution. It is also known [27][28][29] that the size of SnOx nanoparticles in the aqueous solutions depends strongly on pH [30].…”

“…Typically the EMD process entails sensitizing a substrate with a reducing agent followed by metal deposition in a solution containing metal ions and an additional reducing agent. EMD on dielectric substrates lends itself to patterning of metals, first achieved by photo-selective metal deposition [5][6][7][8] (PSMD) using UV light exposure and chemical solutions. PSMD has been employed to deposit copper, silver, and gold using palladium and tin catalysts.…”

A Study of Transient Processes Preceding the Electrodeposition of Cr on Pt

“…Weiner and Schiele (4) have shown that the chromic oxide film that forms in potential region I contains only Cr203 with some traces of the cathode metal.…”

Selective Metal Pattern Fabrication Through Micro-Contact or Ink-Jet Printing and Electroless Plating onto Polymer Surfaces Chemically Modified by Plasma Treatments

“…Surface activation can then be performed using two main processes known as ''two-step'' or ''one-step'' processes. In the former case [27][28][29][30], the oxidized substrate surface is first sensitized by immersion in an acidic tin chloride (SnCl 2 ) solution and then activated by immersion in an acidic palladium 692 F. Bessueille et al…”