Optimization of die bond process parameters of MEMS thermopile chip

Li-guo, 陈立国 Chen; Yong-tao, 姜勇涛 Jiang; Deng-ta, 倪灯塔 Ni; Min-rui, 王敏锐 Wang; Li-ning, 孙立宁 Sun

doi:10.3788/ope.20192701.0137

光学精密工程

2019

DOI: 10.3788/ope.20192701.0137

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Optimization of die bond process parameters of MEMS thermopile chip

陈立国 Chen Li-guo¹,

姜勇涛 Jiang Yong-tao²,

倪灯塔 Ni Deng-ta³

et al.

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Optimization of die bond process parameters of MEMS thermopile chip

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