“…The QCL wafer used in this experiment was grown by metalorganic chemical vapor deposition (MOCVD) on a conducting InP:S substrate [17]. The lower cladding consists of three layers: an InP layer (InP:Si, n = 1 × 10 17 cm −3 , d = 3.5 μm), a thin grading layer (InGaAsP:Si, n = 1 × 10 17 cm −3 , d = 30 nm), and an InGaAs layer (InGaAs:Si, n = 3 × 10 16 cm −3 , d = 520 nm).…”