2024 8th IEEE Electron Devices Technology &Amp;amp; Manufacturing Conference (EDTM) 2024
DOI: 10.1109/edtm58488.2024.10511484
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Optimization of Tungsten Plug Thin Film Process to Improve the Fill Seam and Contact Resistance in 180nm CMOS Technology

A.K. Chauhan,
V.S. Teja,
P. Chawla
et al.
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