Optimized statically non‐wetting hydrophobic electrospun surface of perfluorocyclobutyl aryl ether polymer

Abstract

Statically non‐wetting surface of perfluorocyclobutyl aryl ether (PFCB) polymer was generated through electrospinning. It was observed that different morphologies of the electrospun surface of BP‐PFCB gives different degrees of hydrophobicity.

A spiro-centered thermopolymerizable fluorinated macromonomer: synthesis and conversion to the high performance polymer

“…27,28 The crosslinked networks exhibited good properties including high thermostability, good mechanical strength, low surface energy and dielectric constants, as well as highly visible transmittance. [29][30][31] It is noted that spiro-centered polymers usually show high thermostability and good solubility owing to their rigid skeleton and distorted spiro-moiety. 32,33 However, the dielectric properties of the spiro-centered polymers need to be improved.…”

High stability of photoinduced merocyanine in naphthopyran‐doped polyvinylpyrrolidone electrospun nanofibers

“…All chromatography examinations were performed using silica gel, and thin-layer chromatography was performed using silica plates (made in China). 1 H NMR and 13 C NMR spectra were recorded with a Varian Unity Inova spectrometer at room temperature using chloroform-d and dimethylsulfoxide-d 6 (DMSO-d 6 ) as solvent. Mass spectra were recorded with a Bruker AutoflexIII Smartbeam MS spectrometer.…”

“…The crude product was further purified using column chromatography on silica gel (ethyl acetate-CH 2 Cl 2 1:100) giving an orange solid in 35.5% yield. 1 13…”

“…Electrospinning is widely used in the fabrication of functional fibers from various materials, such as polymers, composites and polymer blends, due to its excellent features such as simplicity, versatility and low cost . The diameters of the fibers range from 10 to 10 000 nm .…”

Crosslinked Fluorinated Poly(arylene ether)s with POSS: Synthesis and Conversion to High-Performance Polymers

“…Among many requirements, thermal performance is the most difficult performance of low-dielectric materials. In the processing of low-dielectric materials, the polymer material used as the interlayer dielectric is resistant to temperatures exceeding 300 • C. Crosslinked polymers have outstanding thermal stability, mechanical properties, and chemical resistance, and the dielectric constant of the polymer can be further lowered due to the chemical structure formed in the reaction [22,23]. In addition, crosslinked polymers have excellent processability.…”