Orientation-related stress analysis of nanotwinned copper in redistributed layer for wafer-level packaging

Wang, Zesong; Zhong, Cheng; Li, Peifeng; Liu, Zhi-Quan

doi:10.1109/icept59018.2023.10492100

2023 24th International Conference on Electronic Packaging Technology (ICEPT) 2023

DOI: 10.1109/icept59018.2023.10492100

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Orientation-related stress analysis of nanotwinned copper in redistributed layer for wafer-level packaging

Zesong Wang,

Cheng Zhong,

Peifeng Li

et al.

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Orientation-related stress analysis of nanotwinned copper in redistributed layer for wafer-level packaging

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References 11 publications

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