Overview: Spoof Surface Plasmon Polariton Transmission Line and Splitters

Zhou, Shiyan; Wong, Sai‐Wai; Luo, Cong; Lin, J. Y.; Li, Yin; Zhang, Long; He, Yejun; Tu, Zhi‐Hong; Yu, Li

doi:10.1109/comcomap46287.2019.9018813

Cited by 5 publications

(3 citation statements)

References 28 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Furthermore, few bands are found to have much a larger bandwidth (>40 GHz). In the existing works, −3 dB bandwidths are found to be 20 GHz, 13 GHz, 4 GHz, 27.6 GHz, 60 GHz and 40 GHz in [11,18,32,33,38,39], respectively. The bandwidths are significantly higher in [35][36][37], about 100 GHz.…”

Section: Performance Summary and Comparisonmentioning

confidence: 95%

“…Thus, it was verified that low-loss and high-speed plasmonic circuits would be configurable for on-chip interconnects. In [18], SSPP transmission lines and splitters have been demonstrated within the frequency range of 2 to 14 GHz. Here the study of impedance analysis and the design of isolation resistor had been left for future work.…”

Section: Related Workmentioning

confidence: 99%

“…[39] 0.04-0.12 THz <−10 dB ∼−1.5dB From Table 3, it can be observed that most of the previous researchers have worked with SSPP interconnects operating in the gigahertz range. For example, 2-14 GHz, 0-10 GHz, 6-11 GHz and 46.1-73.7 GHz are the simulated frequencies found in [18,30,32,33], respectively. However, the existing electrical connectors show fairly good performance in the gigahertz frequency.…”

Section: Performance Summary and Comparisonmentioning

confidence: 99%

See 2 more Smart Citations

Effects of Variation in Geometric Parameters and Structural Configurations on the Transmission Characteristics of Terahertz-Range Spoof Surface Plasmon Polariton Interconnects for Interchip Data Communication: A Finite Element Method Study

Daiyan,

Abi,

Rashid

et al. 2023

Electronics

View full text Add to dashboard Cite

Interconnects have become a major obstacle in chip scaling. Spoof surface plasmon polariton (SSPP) modes have gained attention for their ability to manipulate light beyond diffraction limits at a given frequency, leading to SSPP interconnects. This article investigates the transmission characteristics of SSPP interconnect pairs placed side by side in the terahertz frequency range with comprehensive performance analysis. The proposed SSPP waveguide pair exhibits a maximum transmission coefficient of around −0.05 dB in the −3 dB band in the terahertz frequency range. Due to field confinement near the metal–dielectric interface, energy remains confined for the designed SSPP interconnect pair system. The proposed SSPP structure shows several bands in the terahertz frequency range, whereas conventional interconnects shows almost zero transmission at such frequencies. Additionally, the effect of geometric parameters on transmission coefficients (S21) and coupling coefficients (S41) has been investigated. Moreover, it has been shown that the bandwidth, as well as the upper cutoff frequency, can be tuned by varying the geometric parameters such as groove height, groove width and groove density. Since global interconnects undergo bending in actual circuits during distant data transmission on chips, geometric mismatches may occur between adjacent pairs of SSPP interconnects. Hence, it has also been examined how bending and mismatches affect transmission and coupling coefficients. Several SSPP schemes have been simulated, among which the best performance is obtained with 2 μm mismatch in groove height. For this optimized design, two corrugated metal interconnects are considered with groove heights of 20 μm and 22 μm, respectively, a groove width of 3 μm, a period of 20 μm, and the number of grooves at 50. For this particular configuration, an ultra-wide passband is found having a bandwidth of almost 400 GHz, with a signal reflection of below −12 dB and little insertion loss of ∼−1.43 dB.

show abstract