2019 IEEE 69th Electronic Components and Technology Conference (ECTC) 2019
DOI: 10.1109/ectc.2019.00079
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Package Material Selection Criteria for High Temperature Automotive Applications

R.T.H. Rongen
1
,
A. Mavinkurve
2
,
G.M. O'Halloran
3
et al.
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Cited by 5 publications
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Reliability and Failure of Microelectronic Materials

Mavinkurve
1
,
Rongen
2
,
Soestbergen
3
2022
Reliability of Organic Compounds in Microelectronics and Optoelectronics
1
0
0
0
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Reliability and Failure of Microelectronic Materials

Mavinkurve
1
,
Rongen
2
,
Soestbergen
3
2022
Reliability of Organic Compounds in Microelectronics and Optoelectronics
1
0
0
0
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Influence of Copper Wire Material Additive Elements to the Reliability of Wire Bonded Contacts

Klengel
1
,
Klengel
2
,
Schischka
3
et al. 2020
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
3
0
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Cu-Al IMC degradation under high electric fields during HTOL tests

Mavinkurve
1
,
Rongen
2
,
Soestbergen
3
2022
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
2
0
0
0
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