Packaging and Antenna Integration for Silicon-Based Millimeter-Wave Phased Arrays: 5G and Beyond

Gu, Xiaoxiong; Liu, Duixian; Sadhu, Bodhisatwa

doi:10.1109/jmw.2020.3032891

Cited by 101 publications

(23 citation statements)

References 50 publications

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“…Here, the increasing packing density of tiles with decreasing wavelength requires novel concepts in antenna cointegration and package codesign. A recent comprehensive overview is provided in [201].…”

Section: Heterogeneous Integrationmentioning

confidence: 99%

Millimeter-Wave and Terahertz Transceivers in SiGe BiCMOS Technologies

Kissinger

Kahmen

Weigel

2021

IEEE Trans. Microwave Theory Techn.

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This invited paper reviews the progress of silicon-germanium (SiGe) bipolar-complementary metal-oxidesemiconductor (BiCMOS) technology-based integrated circuits (ICs) during the last two decades. Focus is set on various transceiver (TRX) realizations in the millimeter-wave range from 60 GHz and at terahertz (THz) frequencies above 300 GHz. This article discusses the development of SiGe technologies and ICs with the latter focusing on the commercially most important applications of radar and beyond 5G wireless communications. A variety of examples ranging from 77-GHz automotive radar to THz sensing as well as the beginnings of 60-GHz wireless communication up to THz chipsets for 100-Gb/s data transmission are recapitulated. This article closes with an outlook on emerging fields of research for future advancement of SiGe TRX performance.

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Section: Heterogeneous Integrationmentioning

confidence: 99%

Millimeter-Wave and Terahertz Transceivers in SiGe BiCMOS Technologies

Kissinger

Kahmen

Weigel

2021

IEEE Trans. Microwave Theory Techn.

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“…The synthesis of aromatic polyesters can be achieved with four basic synthesis reactions, i.e., Schotten-Bauman reaction, high-temperature melt transesterification, oxidative esterification, and phenyl ester reaction, the pros and cons of which have been discussed in detail in [4]. In recent years, thermotropic LCPs have gained great attention as promising microwave, millimeter-wave (mmW), and terahertz (THz) circuit substrates and packaging materials for fifth-generation (5G) and Internet of Things (IoTs) applications [5][6][7]. For convenience, we use LCPs to represent thermotropic LCPs in the rest of this paper.…”

Section: Introductionmentioning

confidence: 99%

“…Sooner after, hundreds of functional passive devices, such as filters and antennas, were developed in single-layer and multilayer LCP films, which typically do not require extra bias voltage to work [7,15]. Meanwhile, the integration and packaging of passive and active chips with LCP passive circuits became of great interest, which enabled the commercial application of LCP devices in advanced wireless systems at microwave and mmW frequencies [5,6]. In 2019, the application of flexible LCP antennas and circuits in the Apple iPhone made LCPs well known to the public, which inspired many review articles on LCP technologies relating to various aspects over last two years [5][6][7]15].…”

Section: Introductionmentioning

confidence: 99%

“…Meanwhile, the integration and packaging of passive and active chips with LCP passive circuits became of great interest, which enabled the commercial application of LCP devices in advanced wireless systems at microwave and mmW frequencies [5,6]. In 2019, the application of flexible LCP antennas and circuits in the Apple iPhone made LCPs well known to the public, which inspired many review articles on LCP technologies relating to various aspects over last two years [5][6][7]15]. Gu et al reviewed antenna integration and packaging technologies on LCP substrates in 2020 [5], while Watanabe et al discussed LCP technologies in front-end package applications in 2021 [6], both of which could be used in fifth-generation (5G) wireless communication.…”

Section: Introductionmentioning

confidence: 99%

“…In 2019, the application of flexible LCP antennas and circuits in the Apple iPhone made LCPs well known to the public, which inspired many review articles on LCP technologies relating to various aspects over last two years [5][6][7]15]. Gu et al reviewed antenna integration and packaging technologies on LCP substrates in 2020 [5], while Watanabe et al discussed LCP technologies in front-end package applications in 2021 [6], both of which could be used in fifth-generation (5G) wireless communication. Ji and colleagues summarized the polymerization, chemical structure, aggregated state, modification, and processing of typical LCPs relating to aspects of materials science in 2020 [15], while Khan et al surveyed the mechanical properties of wearable antennas on LCP and other flexible films in 2021 [7].…”

Section: Introductionmentioning

confidence: 99%

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Flexible Liquid Crystal Polymer Technologies from Microwave to Terahertz Frequencies

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With the emergence of fifth-generation (5G) cellular networks, millimeter-wave (mmW) and terahertz (THz) frequencies have attracted ever-growing interest for advanced wireless applications. The traditional printed circuit board materials have become uncompetitive at such high frequencies due to their high dielectric loss and large water absorption rates. As a promising high-frequency alternative, liquid crystal polymers (LCPs) have been widely investigated for use in circuit devices, chip integration, and module packaging over the last decade due to their low loss tangent up to 1.8 THz and good hermeticity. The previous review articles have summarized the chemical properties of LCP films, flexible LCP antennas, and LCP-based antenna-in-package and system-in-package technologies for 5G applications, although these articles did not discuss synthetic LCP technologies. In addition to wireless applications, the attractive mechanical, chemical, and thermal properties of LCP films enable interesting applications in micro-electro-mechanical systems (MEMS), biomedical electronics, and microfluidics, which have not been summarized to date. Here, a comprehensive review of flexible LCP technologies covering electric circuits, antennas, integration and packaging technologies, front-end modules, MEMS, biomedical devices, and microfluidics from microwave to THz frequencies is presented for the first time, which gives a broad introduction for those outside or just entering the field and provides perspective and breadth for those who are well established in the field.

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Radio‐Frequency‐Integrated Circuits

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Amsdon

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This chapter gives an overview of the technology and design of radiofrequency (RF)‐integrated circuits in silicon technology. These circuits have transformed the field of wireless communications, forming the heart of sophisticated multiple‐input, multiple‐output RF transceivers for use in cellular handsets. The technology is now starting to transform new fields in the millimeter‐wave frequency range, enabling it to be used for new consumer applications such as radars for autonomous cars. The chapter describes the key active device technologies and passive components before going on to describe the state of the art in circuit design techniques. There are separate sections dedicated to the design of amplifiers, oscillators, mixers and modulators, and integrated transceivers. A final section gives an introduction to the importance of taking the packaging into account at the chip design and layout stage, as well as describing the rapidly emerging field of RF system‐in‐package technology, where sophisticated millimeter‐wave antenna arrays can be integrated with active circuits. The chapter includes 180 references to research papers describing advanced techniques developed in both industry and academia.

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Packaging and Antenna Integration for Silicon-Based Millimeter-Wave Phased Arrays: 5G and Beyond

Cited by 101 publications

References 50 publications

Millimeter-Wave and Terahertz Transceivers in SiGe BiCMOS Technologies

Millimeter-Wave and Terahertz Transceivers in SiGe BiCMOS Technologies

Flexible Liquid Crystal Polymer Technologies from Microwave to Terahertz Frequencies

Radio‐Frequency‐Integrated Circuits

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