Pad Over Active (POA) solutions for three metal level BCD5 mixed power process - Design and validation of ESD protections

Andreini, A.; Neva, C.; Renard, Loic; Sironi, G.; Speroni, F.; Sponton, L.; Tampellini, F.; Tiziani, R.

doi:10.1016/s0026-2714(03)00245-2

Microelectronics Reliability

2003

DOI: 10.1016/s0026-2714(03)00245-2

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Pad Over Active (POA) solutions for three metal level BCD5 mixed power process - Design and validation of ESD protections

A. Andreini

C. Neva

Loic Renard

et al.

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Pad Over Active (POA) solutions for three metal level BCD5 mixed power process - Design and validation of ESD protections

Cited by 1 publication

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