2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and 2020
DOI: 10.1109/eurosime48426.2020.9152666
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Panel Level Warpage Simulation of Printed Circuit Boards comprising electrical components

J. Zündel
1
,
Thomas Krivec
2
,
Tao Qi
3
et al.
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Cited by 5 publications
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References 11 publications
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Characterization of prepreg shrinkage and investigation of its influence on warpage simulation

Zündel
1
,
Sagerer
2
,
Frewein
3
et al. 2021
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
3
0
0
0
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Characterization of prepreg shrinkage and investigation of its influence on warpage simulation

Zündel
1
,
Sagerer
2
,
Frewein
3
et al. 2021
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
3
0
0
0
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An advanced, systematic simulation approach for studying warpage drivers of an assembled printed circuit board in early development stage

Frewein
1
,
Stojanović
2
,
Qi
3
et al. 2022
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
6
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Evaluation of thermomechanical behavior of electronic devices through the use of a reduced order modelling approach

Weninger
1
,
Zündel
2
,
Krivec
3
et al. 2023
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
5
0
0
0
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