Passivated Busbars from Screen-printed Low-temperature Copper Paste

Wood, D.F.; Kuzma-Filipek, I.; Russell, Richard; Duerinckx, Filip; Powell, Nick E.; Zambova, Adriana; Chislea, Brian; Chevalier, P.; Boulord, C.; Beucher, Alexandre; Zeghers, Nicolas; Deng, Weiwei; Zhu, Feng; Verlinden, Pierre J.; Szlufcik, Jozef; Beaucarne, G.

doi:10.1016/j.egypro.2014.08.052

Cited by 26 publications

(11 citation statements)

References 3 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…A new topic in the field of screen printed metallization is the development and application of screen printable pastes based on Cu instead of Ag [5,[27][28][29][30]. These pastes are designed to prevent oxidation of the Cu particles and Cu diffusion into the solar cells.…”

Section: Screen Printing Technologymentioning

confidence: 99%

Summary of the 5th Workshop on Metallization for Crystalline Silicon Solar Cells

Beaucarne¹,

Schubert

Hoornstra

2015

Energy Procedia

Self Cite

View full text Add to dashboard Cite

The 5 th Metallization Workshop took place in Constance, Germany on 20 and 21 October 2014 and provided an overview of research and development in the field of solar cell metallization. Enhanced understanding of contact structure and formation was obtained thanks to new characterization techniques. Great progress in metallization technologies was also reported. Screen printing technology is continuing its trajectory of continuous improvement, notably with fine-line screen printing (linewidth < 50 μm) becoming a reality. Ni/Cu plating technology is also progressing fast, with many of the technical barriers to adoption being successfully removed. Finally, the workshop also highlighted the move towards a module-centric design of solar cell metallization, targeting high performance and low cost at module level.

show abstract

Section: Screen Printing Technologymentioning

confidence: 99%

Summary of the 5th Workshop on Metallization for Crystalline Silicon Solar Cells

Beaucarne¹,

Schubert

Hoornstra

2015

Energy Procedia

Self Cite

View full text Add to dashboard Cite

show abstract

“…Dow Corning reported papers and patents about a curing-type copper paste and the applicable solar cell structures [47][48][49][50][51]. The curing is referred to as the hardening of polymer materials by cross-linking polymer chains that can be processed by heating at a low temperature under 300°C.…”

Section: Dow Corningmentioning

confidence: 99%

Conductive Copper Paste for Crystalline Silicon Solar Cells

Lee¹,

Lee²

2019

Recent Developments in Photovoltaic Materials and Devices

View full text Add to dashboard Cite

In photovoltaic industries, the main technique of metallization is screen printing with silver pastes due to its simple and quick process. However, the expensive price of silver paste is one of the barriers to the production of low-cost solar cells. Therefore, the most focused target in photovoltaic research is the decreasing consumption of silver paste or substitute silver for other materials. As a proper candidate, copper has been researched by many institutes and companies since it has a similar conductivity with silver even though the price is inexpensive. To apply copper as a contact for solar cells, the plating technique has been actively researched. However, copper paste, which was mainly developed for integrated circuit applications, has been recently researched. Mostly, copper paste was developed for the low-temperature annealing process since copper tends to oxidize easily. On the other hand, firing type copper paste was also developed by coating copper particles with a barrier layer. This chapter discusses recent development of copper paste for the application of solar cells and its appropriate annealing conditions for better electrical properties. Also, the light I-V characteristics of copper paste on the solar cells in other research papers are summarized as well.

show abstract

“…In recent years, novel metallization schemes have been proposed to increase cell efficiencies and reduce cost [53]. Due to price pressures in cell manufacturing, there is a growing interest in the ability to replace silver metallization with a copper based alternative [54,55]. Alternatively, newer device architectures that allow for improved device efficiencies, such as nPERT (n-type passivated emitter, rear totally diffused cell), demand new metallization pastes in order to reduce recombination at the contacts.…”

Section: Emerging Technologiesmentioning

confidence: 99%

Manufacturing metrology for c-Si module reliability and durability Part III: Module manufacturing

Davis

Rodgers

Scardera

et al. 2016

Renewable and Sustainable Energy Reviews

View full text Add to dashboard Cite

This article is the third and final article in a series dedicated to reviewing each process step in crystalline silicon (c-Si) photovoltaic (PV) module manufacturing process: feedstock, crystallization and wafering, cell fabrication, and module manufacturing. The goal of these papers is to identify relevant metrology techniques that can be utilized to improve the quality and durability of the final product. The focus of this article is on the module manufacturing process. The c-Si PV module fabrication process can be divided into three primary areas; (1) stringing and tabbing, (2) lamination, and (3) integration of junction box and bypass diode(s). Each of these processing steps can impact the reliability and durability of PV modules in the field. The ultimate goal of this article is to identify appropriate metrology techniques and characterization methods that can be utilized within a module manufacturing facility to improve the reliability and durability of the final product. Additionally, a gap analysis is carried out to identify areas in need of further research and a discussion is provided that addresses new challenges for advanced materials and emerging technologies.

show abstract

Passivated Busbars from Screen-printed Low-temperature Copper Paste

Cited by 26 publications

References 3 publications

Summary of the 5th Workshop on Metallization for Crystalline Silicon Solar Cells

Summary of the 5th Workshop on Metallization for Crystalline Silicon Solar Cells

Conductive Copper Paste for Crystalline Silicon Solar Cells

Manufacturing metrology for c-Si module reliability and durability Part III: Module manufacturing

Contact Info

Product

Resources

About