Pd effect on reliability of Ag bonding wires in microelectronic devices in high-humidity environments

Cho, Jong-Soo; Yoo, Kyung-Ah; Moon, Jeong-Tak; Son, Seoung‐Bum; Lee, Se-Hee; Oh, Kyu Hwan

doi:10.1007/s12540-012-5021-8

Cited by 23 publications

(8 citation statements)

References 5 publications

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“…5. Not only Yoo, but also other researchers [6,12] observed the same result that Ag (or Agalloy) wire bonded to Au or Pd pad has good reliability. The wire of this category was developed later than low purity Agalloy wire in order to get lower resistivity      cm.…”

Section: mentioning

confidence: 56%

“…[5] and be corroded easily under humid environment [6]; (b) electro chemical migration concern; (c) challenging to be drawn to fine wire without alloying. Therefore, alloyed Ag wire is the one can be served as an alternative lowcost bonding wire.…”

Section: mentioning

confidence: 99%

“…Similarly, Pd addition to Ag wire has positive effect as well. It was reported that Pd alloyed into Ag wire with  will prolong the PCT life, Cho [6] proposed a model that Pd formed a very thin PdO layer outside the Ag wire to prevent Ag be dissolved out, so as not to catalyze Al pad corrosion. In case Al corrosion happening, the "corrosioninduced crack" will propagate along the interface of Ag ballAl pad, and cause failure.…”

Section: Imcmentioning

confidence: 99%

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Review on silver wire bonding

2013

2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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Cu wire bonding has been adopted fast in the past few years in semiconductor industry and has displaced Au wire bonding a significant percentage owing to low cost of Cu wire. However, there are some concerns raised due to high hardness of Cu FAB and corrosion of CuAl IMC at HAST reliability test. These drawbacks constrain the application of Cu wire in some area, like stackeddie package, dietodie wire bonding, and LED assembly. Ag, a softer material in nature, is a good candidate to displace Cu as an alternative low cost bonding wire. There are various compositions of alloyed Ag wire proposed, basically they can be categorized into three groups: (1) Au wire alloyed with Ag, (2) high purity Agalloy wire, and (3) low purity Agalloy wire. This paper will review the recent researches on the three types of the wires bonded to Al, Au and Pd metal pads, IMC formation, and reliability performance. Comparison to Au wire will be addressed. Effect of Pd addition on the reliability performance and Silver migration will be discussed as well.

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Section: mentioning

confidence: 56%

Section: mentioning

confidence: 99%

Section: Imcmentioning

confidence: 99%

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Review on silver wire bonding

2013

2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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“…For instance, Cheng and Hsiao [ 13 ] tried to improve the oxidation and interfacial corrosion resistance of Ag wires through the addition of Au and Pd. Guo and Jong-Soo [ 14 ] revealed that doping with Pd can improve the bonding force of the wire by increasing the interconnect reliability between the solder ball and the pad interface. Tseng et al [ 15 ] plated silver wires with gold to improve its oxidation resistance and mechanical properties.…”

Section: Introductionmentioning

confidence: 99%

Improved Anti-Vulcanization and Bonding Performance of a Silver Alloy Bonding Wire by a Cathodic Passivation Treatment with Palladium

et al. 2022

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As a traditional interconnect material, silver alloy bonding wires are widely used in electronic packaging, but their propensity to vulcanize quickly has not been sufficiently addressed. The current surface anti-oxidation and anti-sulfidation treatments are often accompanied by a decline in bonding performance, which hinders the use of silver alloy bonding wires in new applications. In the present paper, we develop a new cathodic passivation treatment in a Pd-containing solution for silver bonding wires, which not only significantly improves their vulcanization resistance, but also maintains their bonding performance. The surface of the treated wires remains unaffected after vulcanization in 0.3 μg/m3 of ammonium sulfide for 60 min. Compared to a Pd-free passivation treatment, the bonding strength of the wire passivated with the Pd-containing solution improves from 0.20 to 0.27 N. XPS analysis confirms the existence of Pd on the surface of the wire. The solder ball formed an obtuse angle instead of a sharp angle on the pad, which is beneficial for bonding strength.

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“…Addition of palladium or gold to silver wire for bonding applications substantially enhances its resistance to electromigration and improves its reliability. 2 Related studies on silver-based wire have concentrated on silver alloys. Recent advances have illustrated significant improvements in reliability for Ag-8Au-3Pd 3,4 or Ag-4Pd wire.…”

Section: Introductionmentioning

confidence: 99%

Thermoelectric Mechanism and Interface Characteristics of Cyanide-Free Nanogold-Coated Silver Wire

Tseng

Hung

Lui

2015

Journal of Elec Materi

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Traditional bath-plated gold contains a cyanide complex, which is an environmental hazard. In response, our study used a green plating process to produce cyanide-free gold-coated silver (cyanide-free ACA) bonding wire that has been proven to be a feasible alternative to gold bonding wire in semiconductor packaging. In this work, ACA wire annealed at 550°C was found to have stable microstructure and superior mechanical properties. Intermetallic compounds Ag 2 Al and AuAl 2 grew from Ag-Au balls and Al pads after aging at 175°C for 500 h. After current testing, ACA wire was found to have improved electrical properties due to equiaxed grain growth. The gold nanolayer on the Ag surface increased the oxidation resistance. These results provide insights regarding the reliability of ACA wire in advanced bonding processes.

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Pd effect on reliability of Ag bonding wires in microelectronic devices in high-humidity environments

Cited by 23 publications

References 5 publications

Review on silver wire bonding

Review on silver wire bonding

Improved Anti-Vulcanization and Bonding Performance of a Silver Alloy Bonding Wire by a Cathodic Passivation Treatment with Palladium

Thermoelectric Mechanism and Interface Characteristics of Cyanide-Free Nanogold-Coated Silver Wire

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