Abstract:Driven by today's market demand, semiconductor is pushing towards the zero-defect direction. The improvement demanded in semiconductor manufacturing is becoming increasingly challenging. In this paper, common molding defects comprise of voids, incomplete fills, and piping holes are studied systematically, focusing on three key areas: 1) Potential mold flow weakness; 2) Molding temperature stability; as well as 3) Defined pressure effects. The in-depth understanding of mold flow in the LF design is achieved via… Show more
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