2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) 2021
DOI: 10.1109/itherm51669.2021.9503295
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Performance Analysis of Impinging Chip-Attached Micro Pin Fin Direct Liquid Cooling Package for Hotspot Targeted Applications

Vahideh Radmard
1
,
Arad Azizi
2
,
Srikanth Rangarajan
3
et al.
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Cited by 10 publications
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