2015 IEEE 65th Electronic Components and Technology Conference (ECTC) 2015
DOI: 10.1109/ectc.2015.7159585
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Performance evaluation of thermal interface material (TIM1) in FCBGA+HS package using Automatic Test Equipment (ATE) tester and package reliability tests

Sri Priyanka Tunuguntla
1
,
Yu Chunwei
2
,
Daijiao Wang
3
et al.
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Semi-in-situ thermal transport characterization of thermal interface materials through a low-frequency thermoreflectance technique

Li,
Li,
Shi
et al. 2025
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Semi-in-situ thermal transport characterization of thermal interface materials through a low-frequency thermoreflectance technique

Li,
Li,
Shi
et al. 2025
Measurement
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Performance and reliability of TIM in high power HFCBGA

Hu
1
,
Shih
2
,
Kao
3
2015
2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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Thermal Characteristics of Integrated Fan-Out on Substrate (InFO_oS) Packaging Technology

Hsu
1
,
Lin
2
,
Kuo
3
et al. 2020
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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