Planar SiC Power Module Packaging and Interconnections Using Direct Ink Writing

Al-Haidari, Riadh; Alhendi, Mohammed; Richmond, Dylan; Abbara, El Mehdi; Obeidat, Abdullah S.; Somarathna, Udara S.; Schadt, Mark; Poliks, Mark D.; Gowda, Arun; Erlbaum, Jeff; Han, Xing; Hitchcock, Collin

doi:10.1109/ectc51909.2023.00117

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Planar SiC Power Module Packaging and Interconnections Using Direct Ink Writing

Cited by 5 publications

References 27 publications

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