Moisture
and insulation deterioration are important factors that
cause the failure of epoxy packaging materials. Thus, improving the
long-term stability of epoxy resins in a hot and humid environment
is an important prerequisite for electronic components to adapt to
complex working conditions and achieve high power densities. In this
study, fluorinated graphene doped with hydroxy-terminated poly(dimethylsiloxane)
was prepared and self-assembled into a micro/nanostructure on the
surface of an epoxy resin, which effectively improved the surface
hydrophobicity of the epoxy resin. In addition, the doping with hydroxy-terminated
poly(dimethylsiloxane) modified the fluorinated graphene filler, thereby
forming an arch bridge energy band structure inside the epoxy resin
and thus regulating carrier migration. The water absorption of the
epoxy resin decreased from 1.02 to 0.24%, and the surface water contact
angle increased from 93.58 to 133.2°. Moreover, the electrical
insulation performance of the modified epoxy resin was greatly improved
when the surface resistivity and flashover voltage increased by 50.5
and 36.4%, respectively. Therefore, the proposed method realizes a
simultaneous improvement in the hydrophobicity and insulation of epoxy
resins.