Polyimide/crown ether composite film with low dielectric constant and low dielectric loss for high signal transmission

Abstract

Three kinds of fluorinated PI/CEs composite films prepared by a thermal imidization process have a low dielectric constant and low dielectric loss at a high frequency (10 GHz).

A comprehensive study on the effect of molecular chain flexibility on the low-temperature curing ability of polyimides

“…As shown in Fig. 5, the D k of the low-temperature curable PI films with TABPP was lower than most of the reported low dielectric constant PI films, 25,42–45 indicating the potential application of the novel anhydride. This finding provides a new approach for enhancing dielectric properties in advanced packaging applications.…”

Ternary Metal (Cu–Ni–Zn) Oxide Nanocomposite via an Environmentally Friendly Route

“…aureus) and GNB (E. coli) was tested using the agar well diffusion technique. − The antibacterial action of NPs is mediated by a variety of mechanisms. The production of reactive oxygen species (ROS) is the most significant.…”

Increasing Twist Rigidity to Prepare Polyimides with Low Dielectric Constants and Dissipation Factors over a Wide Temperature Range

“…31 Unlike D k , which intuitively depends on molecular polarizability (α) and the number of polarized molecules per unit volume (N), in terms of D f , there is a lack of mature theory for D f . In previous research, interchain interactions have been strengthened using rigid chain copolymerization, 31 crosslinking, 32 crystallization, 8 and blending 33 to restrict the deflection of polar groups in the molecular chain and lessen the D f . Additionally, it has been investigated employing the insertion of tiny body positive groups at particular positions to restrict via interactions between groups inside the chain to minimize the D f , while this raises the D k .…”