Polymer-based low dielectric constant and loss materials for high-speed communication network: Dielectric constants and challenges

Zahidul Islam, MD; Fu, Yaqin; Deb, Hridam; Khalid Hasan, MD; Dong, Yubing; Shi, Shuaida

doi:10.1016/j.eurpolymj.2023.112543

Cited by 35 publications

(4 citation statements)

References 135 publications

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“…Second, low hindrance to electrical signals flowing through adjacent metal circuits (low transmission loss) is vital. 8 The degree of transmission loss depends on the dielectric constant (Dk), an indicator of the response of a material to an electric field. Lower Dk polymers result in lower transmission loss, making them desirable for high-speed communication devices for use in the so-called fifth-and sixth-generation (5G and 6G) societies, where a Dk value below 3.0 is preferred.…”

Section: Introductionmentioning

confidence: 99%

“…Lower Dk polymers result in lower transmission loss, making them desirable for high-speed communication devices for use in the so-called fifth-and sixth-generation (5G and 6G) societies, where a Dk value below 3.0 is preferred. 8 Traditionally, epoxy resins and aromatic polymers, such as polyimides, have been widely used to achieve both high T g and low Dk. 9,10 Their structures are highly rigid, with T g substantially exceeding 200 °C.…”

Section: Introductionmentioning

confidence: 99%

“…In general, a glass transition temperature ( T g ) of over 200 °C is required. Second, low hindrance to electrical signals flowing through adjacent metal circuits (low transmission loss) is vital . The degree of transmission loss depends on the dielectric constant (Dk), an indicator of the response of a material to an electric field.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Manufacturing Low Dielectric Polysaccharide Esters with High Thermal Stability

Fukata,

Kimura,

Iwata

2024

ACS Appl. Polym. Mater.

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We aimed to produce biomass-based plastics derived from polysaccharides for use in electrical devices, such as printed circuit boards (PCBs). We systematically investigated the combination of polysaccharides and side chain structures to achieve specific properties, notably a high glass transition temperature (T g ), for processes like soldering, and a low dielectric constant (Dk) to minimize electrical transmission loss. Three polysaccharides were selected as backbone structures: cellulose (β-1,4-glucan), paramylon (β-1,3-glucan), and α-1,3-glucan. Three types of side chain structures were then introduced: linear, branched, and cyclic, leading to 40 derivatives. Among them, α-1,3-glucan with cyclohexane carboxylate side chains exhibited the most promising properties combining high T g : 205 °C and low Dk: 2.7. Additionally, improving the crystallinity resulted in a further reduction of Dk to 2.5. The high T g and low Dk properties were comparable to, or surpassed, those of conventional polymers used in PCBs, such as epoxy and polyimide (>200 °C, 3−4). Polysaccharide esters are therefore another viable option as insulating polymers in electrical devices.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Manufacturing Low Dielectric Polysaccharide Esters with High Thermal Stability

Fukata,

Kimura,

Iwata

2024

ACS Appl. Polym. Mater.

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“…Currently, because of the development of the chemical industry and available technological capabilities, products made from polymer materials are represented in many sectors of consumer goods: construction, automotive industry, electronics, medicine [1]. These can be polymer membranes for various purposes [2,3], solid-state lithium-metal batteries [4], dielectric materials [5], packaging [6,7], anti-corrosion coatings [8], construction materials [9][10][11].…”

Section: Introductionmentioning

confidence: 99%

A Study of Plant-Filled Polymer Composites Based on Highly Plasticized Polyvinyl Chloride

Samuylova,

Ponomareva,

Sitnikova

et al. 2024

Preprint

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PVC-based materials are bad in terms of biodegradability. To enhance the ecological property of such materials, the fabrication of PVC-based composites using biofillers with acceptable performance characteristics could be considered. In this work, plant-filled PVC-based composite materials were obtained and study their optical, structural, thermal, and mechanical properties depending on the nature of the filler (spruce flour, birch flour, and rice husk) were studied. Increasing the proportion of plant filler somewhat reduces the strength characteristics and reduces the flexibility of the samples. But samples with plant filler allows them to be used at low temperatures without changing the operating characteristics. Some of the fillers affected the thermal stability of composites by increasing their thermal decomposition resistance. So, results have shown that plant-filled polymer composites based on PVC can be used on an equal basis with unfilled PVC plastic compound for some applications such as construction.

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Coordination of Ultralow Permittivity and Higher Thermal Conductivity of Polyimide Induced by Unique Interfacial Self‐Assembly Behavior

Dong,

Wan,

Huang

et al. 2024

Adv Funct Materials

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Upgrading the available dielectric materials is the most effective approach to solve the poor quality of signal transmission and heat buildup caused by high density integration. In this work, a design strategy for multilayer 3D porous composite networks is proposed, relying on the self‐assembly effect of “crystal‐like phase” to achieve the synergistic optimization of low permittivity and high thermal conductivity of polyimide. The obtained three‐layer porous polyimide composite film (PSLS) features an ultralow permittivity of 1.89, an in‐plane thermal conductivity as high as 13.58 W m−1 K−1, and maintains well electrical insulating property. Inspiringly, the first digital thermoacoustic generator with wide frequency response has been designed based on PSLS film. It achieves sound pressure levels up to 60.1 dB in the 20–100 kHz range and integrates the efficient sound generation of an ultrasonic generator with real‐time display. This work will provide a novel concept material for the smart electronics and electrical fields.

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Polymer-based low dielectric constant and loss materials for high-speed communication network: Dielectric constants and challenges

Cited by 35 publications

References 135 publications

Manufacturing Low Dielectric Polysaccharide Esters with High Thermal Stability

Manufacturing Low Dielectric Polysaccharide Esters with High Thermal Stability

A Study of Plant-Filled Polymer Composites Based on Highly Plasticized Polyvinyl Chloride

Coordination of Ultralow Permittivity and Higher Thermal Conductivity of Polyimide Induced by Unique Interfacial Self‐Assembly Behavior

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