1997
DOI: 10.2494/photopolymer.10.55
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Positive-Working Alkaline-Developable Photosensitive Polyimide Precursor Based on Poly(amic acid) and Dissolution Inhibitor.

Abstract: A poly(amic acid) (PAA) was prepared by ring-opening polyaddition of 4,4'-hexafluoroisopropyridenebis(phthalic anhydride) and 1,3-bis(4-aminophenoxy)benzene. The PAA film was very soluble to a tetramethylammonium hydroxide (TMAH) aqueous solution, whereas the dissolution inhibitor, 2,3,4-tris(1-oxo-2-diazonaphthoquinone-5-sulfonyloxy)-benzophenone (D5SB) effectively suppresses the solubility. This film could lead to polyimide exhibiting good thermal stability. An UV-vis.spectrum of the PAA film indicated excel… Show more

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Cited by 26 publications
(16 citation statements)
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“…Thermally stable and photosensitive polymers, especially photosensitive polyimides (PSPIs) (18)(19)(20)(21)(22) and polybenzoxazoles (PSPBOs) (27)(28)(29)(30)(31)(32), are widely used as protection and insulation layers of very-large-scale integrationcircuit multichip modules for computers. Even though PSPIs and PSPBOs have greatly enhanced the progress of microelectronics so far, more technological innovations involving simpler processes and more valuable properties such as transparency, low dielectric constant, higher sensitivity, low temperature cyclization, etc.…”
Section: The Concept Of Chemical Amplification Was Proposed By Ito Wmentioning
confidence: 99%
“…Thermally stable and photosensitive polymers, especially photosensitive polyimides (PSPIs) (18)(19)(20)(21)(22) and polybenzoxazoles (PSPBOs) (27)(28)(29)(30)(31)(32), are widely used as protection and insulation layers of very-large-scale integrationcircuit multichip modules for computers. Even though PSPIs and PSPBOs have greatly enhanced the progress of microelectronics so far, more technological innovations involving simpler processes and more valuable properties such as transparency, low dielectric constant, higher sensitivity, low temperature cyclization, etc.…”
Section: The Concept Of Chemical Amplification Was Proposed By Ito Wmentioning
confidence: 99%
“…The dissolution rate of PAAs in 2.38 wt % aqueous tetramethylammonium hydroxide (TMAHaq) solution is, however, too high to get a sufficient contrast in dissolution rates between unexposed and exposed areas when combined with DNQ derivatives. In a previous paper, 8 we reported the preparation of PSPIs consisting of highly hydrophobic PAAs and DNQ derivatives. PAA-BB is very high hydrophobic: a high dissolution contrast between unexposed and exposed areas could, therefore, be obtained by using DNQ-1, a highly hydrophobic DNQ derivative (Scheme 3).…”
Section: Lithographic Evaluationmentioning
confidence: 99%
“…Based on these considerations, we reported two positive-type and alkaline developable PSPIs [17,18], in which the PAA obtained from 4,4'-hexafluoroisopropyridene-bis(phthalic anhydride) (6FDA) and 1,3-bis(4-aminophenoxy)benzene, or dianhydrides, pyromellitic dianhydrides and biphenyltetracarboxylic dianhydrides, with 2,2'-bis(trifluoromethyl)benzidine, and 2,3,4-tris(1-oxo-2-diazonaphthoquinone-4-yl-sulfonyloxy) benzophenone (D4SB) were used as a matrix and a dissolution inhibitor, respectively. Quite recently, we reported a new fluorinated diazonaphthoquinone (FDNQ) prepared by the reaction of 1,2-naphthoquinone-2-diazido-5-sulfonyl chloride with 4,4'-(hexafluoroisopropylidene) diphenol as a photoactive compound (PAC).…”
Section: Introductionmentioning
confidence: 99%