Power distribution techniques for VLSI circuits

2011

IEEE Trans. VLSI Syst.

Abstract-Higher operating frequencies and greater power demands have increased the requirements on the power and ground network. Simultaneously, due to the larger current loads, current densities are increasing, making electromigration an important design issue. In this paper, methods for optimizing a multi-layer interdigitated power and ground network are presented. Based on the resistive and inductive (both self-and mutual) impedance, a closed-form solution for determining the optimal power and ground wire width is described, producing the minimum impedance for a single metal layer. Electromigration is considered, permitting the appropriate number of metal layers to be determined. The tradeoff between the network impedance and current density is investigated. Based on 65-, 45-, and 32-nm CMOS technologies, the optimal width as a function of metal layer is determined for different frequencies, suggesting important trends for interdigitated power and ground networks.Index Terms-Current density, interdigitated structure, minimal impedance, power and ground (P/G) networks, width optimization.

Section: A Optimal Width For Minimum Impedancementioning

confidence: 99%

“…The need for efficient P/G networks has been recognized, and several algorithms and techniques to optimize the P/G distribution network have been reported [10], [11]. A routing tool for standard cell circuits to efficiently supply and distribute power has been proposed in [12].…”

mentioning

confidence: 99%

Multi-Layer Interdigitated Power Distribution Networks

2011

IEEE Trans. VLSI Syst.

“…Several algorithms and techniques to optimize the P/G distribution network have been reported, focusing only on the resistive component [7]. More advanced algorithms based on different optimization techniques have been developed; however, only the package inductance is considered [8], neglecting the on-chip inductance.…”

Section: Introductionmentioning

confidence: 99%

Methodology for multi-layer interdigitated power and ground network design

Proceedings of 2010 IEEE International Symposium on Circuits and Systems

2010

Abstract-Higher operating frequencies and greater power demands have increased the requirements on the power and ground network. Simultaneously, due to the larger current loads, current densities are increasing, making electromigration an important design issue. The optimal wire width for an interdigitated power and ground network is based on the resistive and inductive (both self-and mutual) impedance. In this paper, a methodology for optimizing a multi-layer interdigitated power and ground network is presented, reducing the current density and impedance of a network. Based on 65 nm, 45 nm, and 32 nm CMOS technologies, the optimal width as a function of metal layer is determined for different frequencies, suggesting important trends for interdigitated power and ground networks.

“…The need for efficient P/G networks has been recognized, and several techniques to optimize the P/G distribution network have been developed [9,10]. More advanced techniques for designing power networks have been described [11,12]; however, only the package inductance is considered, neglecting the on-chip inductance.…”

Section: Introductionmentioning

confidence: 99%

Line width optimization for interdigitated power/ground networks

Proceedings of the 20th Symposium on Great Lakes Symposium on VLSI

2010

Higher operating frequencies have increased the importance of inductance in power and ground networks. The effective inductance of the power and ground network can be reduced with an interdigitated structure. A closed-form solution for determining the optimal power and ground wire width is described, producing the minimum impedance within an interdigitated structure. The optimal wire width is determined under different physical network dimensions and signal frequencies, suggesting useful trends for interdigitated power and ground networks. In addition, a closed-form expression for the optimal wire width is determined that minimizes the voltage drop over a single metal layer of an interdigitated power/ground network.