Power QFN Tiger device down bond bond-ability study

Abstract

Power QFN Tiger device failed the down bond open on TC500 or application. Failure analysis verified that it was caused by down bond delamination. Finite Element Analysis modeling was established to analyze the Tiger down bond stress and find out a new position with relative less stress impact as down bond end point. Meanwhile, new bonding model with security loop was applied to down bond to improve the bondability and passed all reliability test.