2015 International 3D Systems Integration Conference (3DIC) 2015
DOI: 10.1109/3dic.2015.7334573
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Power saving and noise reduction of 28nm CMOS RF system integration using integrated fan-out wafer level packaging (InFO-WLP) technology

Chuei-Tang Wang
1
,
Jeng-Shien Hsieh
2
,
Victor C. Y. Chang
3
et al.
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Cited by 6 publications
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