“…IV. APPLICATION FOR POWER DELIVERY NETWORK Rejection of noise in power supply of VLSI circuit becomes more challenging due to the shrinking chip area, increased circuit density, lower operating supply voltage, and demand for faster communication link [6], [9]- [13]. The illustration of poorly regulated power supply in PDN due to switching noise is shown in Fig.…”
embedded in fully Cu-filled through-silicon via and its thermo-mechanical reliability for power delivery applications. 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 393-398.
“…IV. APPLICATION FOR POWER DELIVERY NETWORK Rejection of noise in power supply of VLSI circuit becomes more challenging due to the shrinking chip area, increased circuit density, lower operating supply voltage, and demand for faster communication link [6], [9]- [13]. The illustration of poorly regulated power supply in PDN due to switching noise is shown in Fig.…”
embedded in fully Cu-filled through-silicon via and its thermo-mechanical reliability for power delivery applications. 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 393-398.
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