2015
DOI: 10.1016/j.tsf.2015.01.006
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Preferential {100} grain orientation in 10 micrometer-thick laser crystallized multicrystalline silicon on glass

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Cited by 26 publications
(34 citation statements)
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“…Moreover, this cap layer prevents from the dewetting of the liquid Si thin film as well. Then the samples were crystallized using a line shaped cw laser (λ = 808 nm ± 10 nm) from LIMO GmbH30. The used optical intensity for the crystallization process was around 3.58 kW/cm 2 .…”
Section: Methodsmentioning
confidence: 99%
“…Moreover, this cap layer prevents from the dewetting of the liquid Si thin film as well. Then the samples were crystallized using a line shaped cw laser (λ = 808 nm ± 10 nm) from LIMO GmbH30. The used optical intensity for the crystallization process was around 3.58 kW/cm 2 .…”
Section: Methodsmentioning
confidence: 99%
“…Subsequently 10 μm silicon was deposited by electron‐beam evaporation. After this, both samples were crystallized with a 3 cm wide, line‐shaped, continuous wave, diode laser ( λ = 808 nm) and a laser crystallization scanning velocity ( v laser ) of 3 mm s −1 . The Si absorber of the sample with the SiO x N y interlayer (called “SiO x N y cell” in this work) had an acceptor density ( N A ) of 6 · 10 16 cm −3 and the silicon was textured with KOH, etching away ∼1.5 μm.…”
Section: Sample Preparation and Characterizationmentioning
confidence: 99%
“…The interlayer stack serves as diffusion barrier, anti‐reflection coating and passivation layer and is usually composed of silicon oxide (SiO x ), silicon nitride (SiN x ), and/or silicon oxynitride (SiO x N y ) layers . The resulting LPC‐Si layer has an average grain size comparable to that of multi‐crystalline wafers . In 2011, an open circuit voltage ( V OC ) of 545 mV was realized on LPC‐Si.…”
Section: Introductionmentioning
confidence: 99%
“…The laser had a wavelength of λ Laser = 808 nm and was operated with a power density of P Laser = 2100 W cm −2 . Crystallization of the a‐Si layer resulted in a in the formation of a polycrystalline silicon layer with a with a preferential {100} grain orientation . Prior to crystallization, the samples were slowly pre‐heated from 400 to 700 °C to reduce thermal stress.…”
Section: Sample Preparationmentioning
confidence: 99%