2007
DOI: 10.1016/j.eurpolymj.2006.12.030
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Preparation, thermal properties, morphology, and microstructure of phosphorus-containing epoxy/SiO2 and polyimide/SiO2 nanocomposites

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Cited by 80 publications
(29 citation statements)
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“…The chemical bonding retains silicon in the condensed phase, which leads to the formation of a surface glassy char acting as a barrier to heat and mass transfer [3,7,16]. 9,10-Dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) is a type of cyclic phosphate with a diphenyl structure, which has high thermal stability, good oxidation resistance, and good water resistance [5,17]. In our previous work [18], we described the successful synthesis of DOPO-containing polyhedral oligomeric silsesquioxane (DOPO-POSS) (Scheme 1).…”
Section: Introductionmentioning
confidence: 99%
“…The chemical bonding retains silicon in the condensed phase, which leads to the formation of a surface glassy char acting as a barrier to heat and mass transfer [3,7,16]. 9,10-Dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) is a type of cyclic phosphate with a diphenyl structure, which has high thermal stability, good oxidation resistance, and good water resistance [5,17]. In our previous work [18], we described the successful synthesis of DOPO-containing polyhedral oligomeric silsesquioxane (DOPO-POSS) (Scheme 1).…”
Section: Introductionmentioning
confidence: 99%
“…Most of these modifications have been carried out by incorporating silicones in between N-hetero atom of polyimide linkage [1][2][3][4][5][6]. Polysilsesquioxanes and silica have also been used as reinforcing agent in such type of hybrid polymers for further improvement in certain properties to make these materials suitable for microelectronic devices [14][15][16]. So far, to the best of our knowledge, no attempt has been made to prepare such hybrid derivatives of PIs and silicones where silicon atom is attached directly to imide ring through Si C bond.…”
Section: Introductionmentioning
confidence: 99%
“…DOPO, a cyclic phosphate with a diphenyl structure, exhibits high thermal stability, oxidation resistance, and good water resistance [7]. DOPO is always incorporated into epoxy resins or other polymers to improve their flame-retardant properties and thermal stability [8]. It is believed that the chemical structure of such materials containing both of phosphorus and DOPO would show excellent flame-retard performance.…”
Section: Introductionmentioning
confidence: 99%