Prevailing Lead-Free Materials

Lau, John H.; Lee, Ning-Cheng

doi:10.1007/978-981-15-3920-6_2

Cited by 2 publications

(1 citation statement)

References 9 publications

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“…In response to concerns about the environment and human health, a number of countries have launched a series of policies and legislations to ban the use of lead. For example, the European Union introduced two draft proposals named the Waste Electrical and Electronic Equipment (WEEE) and the Reduction of Hazardous Substances (RoHS) directives [13,14,15]. Japan required all new electronic/electrical products to be lead free.…”

Section: Introductionmentioning

confidence: 99%

A Novel Preparation Method of Electrically Conductive Adhesives by Powder Spraying Process

Dong

et al. 2019

Materials

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In a conventional electrically conductive adhesive (ECA) preparation process, typical ECAs are made by adding an appropriate amount of electrically conductive fillers, such as silver, into a polymer matrix, such as epoxy resin, to form a uniformly dispersed mixture by mixing and stirring operations. However, during the preparation process, secondary pollution and mass loss are caused by the vigorous mixture process. At the same time, the stirring operation introduces many small and stable bubbles, which affect the electrical conductivity of the ECAs. In light of these problems with the conventional preparation of ECAs, we developed a novel ECA preparation method that employs a powder spraying process: silver flakes are sprayed into the epoxy resin with a certain mass fraction to form formulated pastes. The as-prepared ECAs exhibited excellent properties compared with those prepared by the conventional process. This proves that the powder spraying process is feasible and superior to the conventional process.

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Section: Introductionmentioning

confidence: 99%

A Novel Preparation Method of Electrically Conductive Adhesives by Powder Spraying Process

Dong

et al. 2019

Materials

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Optimization of Hot Air Solder Leveling (Hasl) Machine for a Robust Surface Finish in Soldering Applications

Ramli¹,

Amli²,

SAUD³

et al. 2023

EJMSE

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Hot Air Solder Leveling (HASL) is one of the most commonly used surface finishes in the industry. HASL is also one of the least expensive types of PCB surface finishes available. This study aims to examine the influence on the solder joint microstructure of dipping time and solder temperature. During soldering process, the temperature that used were 300°C and 400°C. The dipping time was split into three batches which is 20s, 60s, and 100s. The Sn-0.7Cu-0.05Ni solder alloy was used in this analysis to shape the solder coating microstructure. In this analysis, an Optical Microscope (OM) was used to determine the microstructure of the shape of the solder coating microstructure. As dipping time and dipping speed increased, the interfacial IMC thickness was found to increase, grown up and getting thicker. This outcome results can be used as the basis in order to improve the solder joint properties.

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Prevailing Lead-Free Materials

Cited by 2 publications

References 9 publications

A Novel Preparation Method of Electrically Conductive Adhesives by Powder Spraying Process

A Novel Preparation Method of Electrically Conductive Adhesives by Powder Spraying Process

Optimization of Hot Air Solder Leveling (Hasl) Machine for a Robust Surface Finish in Soldering Applications

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