Printability study of reticle defects on wafer using Reticle Defect Review on E-beam review tools

Abstract

In this paper we evaluate the Reticle Defect Review feature on KLA-Tencor's e-beam review tool, eDR™-7110, and study defect printability of reticle defects on wafer. The RDR feature is able to read KLA-Tencor's reticle inspection results directly without any intermediate format, thus allowing what-you-see-is-what-you-get setup on the wafer review tool. Compared with a conventional reticle to wafer approach using KLA Results Files, Reticle Defect Review provides faster time to results, more accurate defect disposition and increased ease of use, which have been demonstrated by the printability study of reticle defects on a focus exposure matrix wafer.