Process-Quality Evaluation for Wire Bonding With Multiple Gold Wires

Abstract

Taiwan is a world-leader in wafer foundry services and IC packaging and testing. Wire bonding is a crucial process in the overall IC-packaging industry chain. Thus, this paper proposes a processquality evaluation model for wire bonding with multiple gold wires. We chose process quality indices as a tool of evaluation fully mirroring process yield and quality levels. These indices contain unknown parameters and thus require sample data to estimate. We first derived the uniformly minimum variance unbiased estimator of the indices and calculated the upper confidence limits of the indices based on DeMorgan's theorem and Boole's inequality. The upper confidence limits of the indices were then employed to create a confidence interval-based fuzzy membership function, in order to improve the accuracy of estimation as well as solve the problem of uncertainty of the measured data. Next, we obtained the fuzzy critical value and used index estimates and the fuzzy critical value to establish fuzzy test rules. Next, we marked the fuzzy critical value on the axes of a radar chart, which is a visualization evaluation tool, and connected neighboring critical points to create a critical region in the form of a regular polygon. The observed values of the indices were then marked on the axes to produce a visualized fuzzy radar evaluation chart. This fuzzy radar evaluation chart has a solid foundation in statistical inference, and evaluation rules were established using precise fuzzy test methods. Not only is this fuzzy radar evaluation chart easy to use, but it also reduces the chance of misinterpretations made by sampling errors, so that the accuracy of evaluation can be enhanced. INDEX TERMS process quality index, fuzzy critical value, critical region, wire bonding, radar chart.

Comparative Analysis Four Different Ways of Calculating Yield Index SSSpk Based on Information of Control Chart, and Six Sigma, to Measuring the Process Performance in Industries: Case Study in Aden’s Oil Refinery, Yemen

“…Capacity analysis is more precisely summarized in indices and techniques that are used to measure, recognize uncertainty, and report the system's process capability and performance. For the past two decades, process capacity analysis has been used in a wide range of industries and organizations, including defining process requirements for new products, vendor selection, predicting a process' ability to hold tolerance, formulating quality assurance plans, and assisting designers in selecting and adjusting processes and maintaining product quality [2], [18]- [23].…”

“…Finally the forth way for estimator yield process by the information control chart as shown at Eq (17). All cases can be arranged as follows: (18) All cases estimation focused on keep track of yield process and the gap between the process's mean change and the target value at all times.…”

“…All of the series are tested with constant and trend, and the best lag is chosen based on the frequency of the data. According to Perron, P. (1989) [18] experimenting with a range of values is normal, and the frequency of the data can be used as a criterion for selecting the number of lags of the residuals. The t-statistics were bigger than their critical value, indicating that all of the variables evaluated were integrated of order zero or stationary with the I(0) process at the 5% significant level.…”

Novel Service Efficiency Evaluation and Management Model

“…Furthermore, a large number of studies have also suggested that the radar chart is a visual 2D plan, which is a practical graphical analysis and management tool with high readability and a wide range of applications, including engineering, education, management, etc. [19][20][21][22][23][24][25][26][27]. The radar chart can evaluate the performance of all workstations at the same time.…”

Rationally Designing the Trace of Wire Bonder Head for Large-Span-Ratio Wire Bonding in 3D Stacked Packaging

“…Gold wire bonding is the most commonly used technology to interconnect chips with low cost in microelectronics packaging. Since its invention in the 1960s, wire bonding has evolved into a dominant form of first-level chip or circuit interconnect with a large number of fixed user groups and equipment reserves [6][7][8][9][10][11][12][13]. Threedimensional stacked packaging through large-span-ratio and high-density wire bonding can maximize chip integration, boost the device performance, reduce the device size, and shorten the development cycle, which will further ensure a smooth transition of interconnect technology in the Post Moore Era [14].…”