Process Simulation of BGA Package

Sakai, Hidehisa; Shiratori, Masaki; Yu, Qiang; Kaneko, Masahide; Fukuda, Takashi; Motegi, Masanori

doi:10.1299/jsmecmd.2000.13.669

The Proceedings of the Computational Mechanics Conference

2000

DOI: 10.1299/jsmecmd.2000.13.669

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Process Simulation of BGA Package

Hidehisa Sakai

Masaki Shiratori

Qiang Yu

et al.

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A study on the thermal deformation and the mechanical properties due to curing process of the encapsulation resin

Sato

2009

2009 11th Electronics Packaging Technology Conference

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Process Simulation of BGA Package

Cited by 3 publications

References 0 publications

A study on the thermal deformation and the mechanical properties due to curing process of the encapsulation resin

A study on the thermal deformation and the mechanical properties due to curing process of the encapsulation resin

Measurement methods for curing properties of resin considering process condition and effects on package

Measurement methods for curing properties of resin considering process condition

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