Producing large-scale industrially applicable high-precision copper strips by continuous extrusion with a novel U-shaped die

Zhou, Mo; Yun, Xueyan; Fu, Hongwang

doi:10.1016/j.jmapro.2022.08.037

Cited by 7 publications

(1 citation statement)

References 20 publications

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“…Currently, thin copper plates, renowned for their remarkable thermal and electrical conductivity, excellent ductility, and inherent resistance to corrosion, are indispensable in various fields such as construction, automotive manufacturing, electrical components, and marine applications, showcasing their crucial role in modern technology and industry [1][2][3][4]. However, the copper plate may exhibit slight surface imperfections generated during the manufacturing process [5]. Timely detection of these tiny or micro defects could prevent their progression into larger structural and mechanical integrity issues.…”

Section: Introductionmentioning

confidence: 99%

Thin Copper Plate Defect Detection Based on Lamb Wave Generated by Pulsed Laser in Combination with Laser Heterodyne Interference Technique

Wang,

Zhu,

Guo

et al. 2024

Sensors

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Thin copper plate is widely used in architecture, transportation, heavy equipment, and integrated circuit substrates due to its unique properties. However, it is challenging to identify surface defects in copper strips arising from various manufacturing stages without direct contact. A laser ultrasonic inspection system was developed based on the Lamb wave (LW) produced by a laser pulse. An all-fiber laser heterodyne interferometer is applied for measuring the ultrasonic signal in combination with an automatic scanning system, which makes the system flexible and compact. A 3-D model simulation of an H62 brass specimen was carried out to determine the LW spatial-temporal wavefield by using the COMSOL Multiphysics software. The characteristics of the ultrasonic wavefield were extracted through continuous wavelet transform analysis. This demonstrates that the A0 mode could be used in defect detection due to its slow speed and vibrational direction. Furthermore, an ultrasonic wave at the center frequency of 370 kHz with maximum energy is suitable for defect detection. In the experiment, the size and location of the defect are determined by the time difference of the transmitted wave and reflected wave, respectively. The relative error of the defect position is 0.14% by averaging six different receiving spots. The width of the defect is linear to the time difference of the transmitted wave. The goodness of fit can reach 0.989, and it is in good agreement with the simulated one. The experimental error is less than 0.395 mm for a 5 mm width of defect. Therefore, this validates that the technique can be potentially utilized in the remote defect detection of thin copper plates.

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