Journal of Materials Research and Technology
 2024
DOI: 10.1016/j.jmrt.2024.10.251
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Properties of Sn-3.0Ag-0.5Cu solder joints under various soldering conditions: Reflow vs. Laser vs. Intense Pulsed Light soldering

Eun-Chae Noh,
Hyo-Won Lee,
Jong-Woong Kim
et al.
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