Put-in microconnectors for alignment-free coupling of optical fiber arrays

Sasaki, Asako; Baba, Toshihiko; Iga, Kenichi

doi:10.1109/68.149905

Cited by 20 publications

(2 citation statements)

References 6 publications

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“…For example, additional macro patterning of V-grooves via anisotropic etching of the silicon substrate can be used as a self-alignment scheme. , Such a structure will enable easy and accurate alignment by hands. Other passive alignment strategies including optical plugs, ferrules, and fiber-arrays can also be used for precise self-alignment of the chips. − These approaches will enable stackable heterointegrated chips to be readily reconfigurable.…”

Section: Other Approaches Of Memristive Technologymentioning

confidence: 99%

Recent Advances and Future Prospects for Memristive Materials, Devices, and Systems

et al. 2023

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Memristive technology has been rapidly emerging as a potential alternative to traditional CMOS technology, which is facing fundamental limitations in its development. Since oxide-based resistive switches were demonstrated as memristors in 2008, memristive devices have garnered significant attention due to their biomimetic memory properties, which promise to significantly improve power consumption in computing applications. Here, we provide a comprehensive overview of recent advances in memristive technology, including memristive devices, theory, algorithms, architectures, and systems. In addition, we discuss research directions for various applications of memristive technology including hardware accelerators for artificial intelligence, in-sensor computing, and probabilistic computing. Finally, we provide a forward-looking perspective on the future of memristive technology, outlining the challenges and opportunities for further research and innovation in this field. By providing an up-to-date overview of the state-of-the-art in memristive technology, this review aims to inform and inspire further research in this field.

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Section: Other Approaches Of Memristive Technologymentioning

confidence: 99%

Recent Advances and Future Prospects for Memristive Materials, Devices, and Systems

et al. 2023

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“…The fabrication was only limited to a two-row fiber array and proved difficult to extend to the manufacture of a square array [11]. Asako et al proposed a self-aligning method using array connectors for the optical interconnection between optical fibers and microlenses [12]. The method had an alignment accuracy of only 8 μm but was claimed by the authors to be suitable for mass production.…”

Section: Introductionmentioning

confidence: 99%

Manufacture of a 2D optical fiber array coupler with micrometer precision for laser radar applications

Chen

Wang

et al. 2014

J. Micromech. Microeng.

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This article presents the manufacture of a 2D-fiber array coupler using UV-LIGA technology for the precise positioning of a two-dimensional (2D) optical fiber array. The precision of the alignment of the eight-by-eight fiber array was demonstrated to be less than 2 μm. The average concentricity error of the fibers to the positioning holes of the array coupler had a minimum and maximum error of 1.7 µm and 6.5 μm, respectively. The 2D fiber array coupler can fulfill the coupling and transmission requirements of 2D light spots for laser radar applications. The method developed here can easily be extended to the manufacture of larger arrays.

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Advanced optical packaging technology for practical integrated photonic modules

Nakajima

1995

Electron Comm Jpn Pt II

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For optical communication technology, which has been pushing for higher speed and larger capacity in the transmission trunk lines, the urgent tasks are not only improvements in performance but also the expansion of applicable areas by introducing new functions and moving into new phases. For optical fibers to be applicable in access net, subscriber loop, intrastation transmission systems, and interprocessor connections, the realization of optical links that are easy to use, easy to fabricate; and inexpensive, is strongly demanded. Also, the appearance of optical nodes everywhere in the broad bandwidth network that will be the backbone of the multimedia society would not be too far off. Research on integrated optical devices and circuits that have new structures for waveguide‐type devices, array components, or two‐dimensional devices, is continuing to progress to meet these demands. To mount these devices and circuits compactly and inexpensively into packages and modules, innovative packaging techniques have to be developed correspondingly. From this viewpoint, this paper reviews optical packaging technology, which holds the key to the realization of integrated photonics.

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Put-in microconnectors for alignment-free coupling of optical fiber arrays

Cited by 20 publications

References 6 publications

Recent Advances and Future Prospects for Memristive Materials, Devices, and Systems

Recent Advances and Future Prospects for Memristive Materials, Devices, and Systems

Manufacture of a 2D optical fiber array coupler with micrometer precision for laser radar applications

Advanced optical packaging technology for practical integrated photonic modules

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