Quantitative Analysis of Resistance Variations in Nickel-Phosphorus (NiP) Resistors

Cheng, Po-Tai; Leung, Siu Fai; Law, T.W.; Liu, C.K.; Chong, Jones Iok Tong; Lam, David Chuen Chun

doi:10.1109/tcapt.2007.897952

Cited by 2 publications

(2 citation statements)

References 4 publications

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“…To enhance light absorption by QDs and achieve high color conversion, several attempts were recently made, and the employment of reflection mirror, light scattering medium, and QD/photoresist mixture has shown promising results. [ 118–120 ]…”

Section: Display Applicationmentioning

confidence: 99%

Micro‐Light Emitting Diode: From Chips to Applications

Parbrook

Corbett

Han

et al. 2021

Laser & Photonics Reviews

157

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Typical light‐emitting diodes (LEDs) have a form factor >(300 × 300) µm2. Such LEDs are commercially mature in illumination and ultralarge displays. However, recent LED research includes shrinking individual LED sizes from side lengths >300 µm to values <100 µm, leading to devices called micro‐LEDs. Their advent creates a number of exciting new application spaces. Here, a review of the principles and applications of micro‐LED technology is presented. In particular, the implications of reduced LED size in necessitating mitigation strategies for nonradiative device edge damage as well as the potential for higher drive current densities are discussed. The opportunities to integrate micro‐LEDs with electronics, and into large‐scale arrays, allow pixel addressable scalable integrated displays, while the small micro‐LED size is ideal for high‐speed modulation for visible light communication, and for integration into biological systems as part of optogenetic therapies.

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Section: Display Applicationmentioning

confidence: 99%

Micro‐Light Emitting Diode: From Chips to Applications

Parbrook

Corbett

Han

et al. 2021

Laser & Photonics Reviews

157

View full text Add to dashboard Cite

show abstract

“…Their methods include the low temperature co-fired ceramics (LTCC) [8], lamination approach [9], thin film deposition technique [10] and plating method [11]. The material and characteristics of various embedded passive techniques are different as well as their fabrication methods.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of integrated resistors in printed circuit boards

Wang

Chan

2011

J. Cent. South Univ. Technol.

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In order to utilize integrated passive technology in printed circuit boards (PCBs), manufacturing processing for integrated resistors by lamination method was investigated. Integrated resistors fabricated from Ohmega technologies in the experiment were 1 408 pieces per panel with four different patterns A, B, C and D and four resistance values of 25, 50, 75 and 100 Ω. Six panel per batch and four batches were performed totally. The testing was done for 960 pieces of integrated resistors randomly selected with the same size. The value distribution ranges and the relative standard deviation (RSD) show that the scatter degree of the resistance decreases with the resistor size increasing and/or with the resistance increasing. Patterns D with resistance of 75 and 100 Ω for four patterns have the resistance value variances less than 10%. Patterns C and D with resistance of 100 Ω have the manufacturing tolerance less than 10%. The process capabilities are from about 0.6 to 1.6 for the designed testing patterns, which shows that the integrated resistors fabricated have the potential to be used in multilayer PCBs in the future.

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Quantitative Analysis of Resistance Variations in Nickel-Phosphorus (NiP) Resistors

Cited by 2 publications

References 4 publications

Micro‐Light Emitting Diode: From Chips to Applications

Micro‐Light Emitting Diode: From Chips to Applications

Fabrication of integrated resistors in printed circuit boards

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