Rapid fabrication of conductive copper patterns on glass by femtosecond Laser-Induced reduction

Cui, Mengya; Huang, Ting; Xiao, Rongshi

doi:10.1016/j.apsusc.2022.152915

Cited by 11 publications

(9 citation statements)

References 23 publications

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“…[ 31,32 ] The temperature during the reduction process, which is controlled by laser parameters, is of great relevance, as it affects the reduction reaction and the resulting electrical resistivity. [ 33 ] Inadequate temperature leads to inadequate reduction, while excess temperature re‐oxidizes the reduced Cu, leading to a higher electrical resistivity. For continuous‐wave laser, poor input energy regulation usually leads to poor temperature control and thereby higher electrical resistivity of the metal coating.…”

Section: Resultsmentioning

confidence: 99%

High‐Efficiency and Low‐Intensity Threshold Femtosecond Laser Direct Writing of Precise Metallic Micropatterns on Transparent Substrate

Cui

Huang

Peng

et al. 2023

Adv Materials Technologies

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Laser direct writing (LDW) is a promising approach for fabricating metallic micropatterns on transparent substrates for transparent electronic circuits that satisfy both electronic and optical criteria. However, high efficiency and precision patterning remain a challenge for both photochemical and photothermal LDW. Herein, a novel method is proposed with a femtosecond laser to achieve a highly‐efficient photothermal process via single‐photon absorption by photosensitive particles (SPA‐FsLDW). The dispersive photosensitive particles act as numerous heating sources, enabling simultaneous multiple‐location photothermal reactions and highly‐efficient metallization due to heat‐induced metal ion reduction. The new approach effectively exploits the excellent heat‐input regulation with the ultrashort pulse of the femtosecond laser to achieve great temperature controllability and precision. It is shown that, with a deposition rate of ≈107 µm3 s−1 and electrical resistivity of ≈10−7 Ω m, SPA‐FsLDW improves efficiency and electrical resistivity by at least one order of magnitude compared to previously reported FsLDW. A self‐powered sensor is fabricated using SPA‐FsLDW, demonstrating its practical applicability.

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Section: Resultsmentioning

confidence: 99%

High‐Efficiency and Low‐Intensity Threshold Femtosecond Laser Direct Writing of Precise Metallic Micropatterns on Transparent Substrate

Cui

Huang

Peng

et al. 2023

Adv Materials Technologies

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“…Copper (Cu) is more suitable for fabrication of metallic micro/nanostructures due to its low cost but similar electrical and thermal conductivity and catalytic property compared with gold and silver. In recent years, Cu micro/nanostructures have been widely used and shown excellent performance in integrated circuits, flexible sensors, , microheaters, and photodetectors. , Because the fabrication of Cu micro/nanostructures by using lithography plus evaporation or etching is complex and expensive, several kinds of direct writing methods, including inkjet printing, ,, electrochemical printing, and laser direct writing − have been reported for the fabrication of Cu micro/nanostructures. Compared with other methods, laser direct writing is more flexible and accurate.…”

Section: Introductionmentioning

confidence: 99%

Direct Writing of Semiconducting and Conducting Microstructures by Using Selective Laser Sintering and Reduction of CuO Nanoparticles

Li,

Zou,

et al. 2024

ACS Appl. Nano Mater.

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Additive and subtractive manufacturing and selective reduction of CuO microstructures were realized and investigated by employing a femtosecond laser. The changes of the morphologies and cross section shapes of additively manufactured CuO wires were systematically analyzed, and a CuO microstructure with a feature width of 947 nm was fabricated by using a hybrid method of selective laser sintering and ablation. The fabricated CuO microstructures were further reduced to conductive Cu microstructures by using selective laser-induced chemical reduction. The feature size, composition, and electrical performance of the fabricated Cu microstructures were studied. Cu microwires with electrical resistivities of about 8.76 × 10 −7 Ω•m were achieved, and several Cu and CuO/Cu composite microstructures were also fabricated by using the combined method of selective laser sintering and reduction. This hybrid and combined manufacturing method provides a flexible, low-cost, and accurate protocol for fabricating CuO, Cu, and their composite microstructures.

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“…Flexible electronics have attracted growing attention in diverse fields such as industry, medicine, and commerce. − Conductive structures are essential for integrating various functional parts such as sensors, detectors, and controllers into electronic systems. − The integration and miniaturization of flexible electronics pose an increased requirement for the conductivity and stability of these structures.…”

Section: Introductionmentioning

confidence: 99%

Laser Writing of Cu–Ag Alloy Flexible Electrodes with Excellent Oxidation and Electrochemical Migration Resistances

Zhou

Guo

Sun

et al. 2023

ACS Appl. Electron. Mater.

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Bimetallic Cu−Ag conductive structures hold great promise in integrating flexible electronics, but fabrication of these structures requires complex multistep processes with poor controllability. Herein, we develop a one-step laser writing process for manufacturing the flexible Cu−Ag conductive structure from a metallic salt. The effect of laser parameters and precursor traits on the writing process, as well as the joining mechanism of Cu−Ag nanostructures, has been discussed systematically. The fabricated Cu−Ag structure not only exhibits remarkable conductivity with a resistivity of ∼8 μΩ cm but also has excellent oxidation and electrochemical migration resistances. Flexible electronic devices fabricated from these written structures, such as the flexible heater, were demonstrated as a proof of concept, thereby demonstrating excellent stability even in high-humidity-and-temperature working conditions.

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Rapid fabrication of conductive copper patterns on glass by femtosecond Laser-Induced reduction

Cited by 11 publications

References 23 publications

High‐Efficiency and Low‐Intensity Threshold Femtosecond Laser Direct Writing of Precise Metallic Micropatterns on Transparent Substrate

High‐Efficiency and Low‐Intensity Threshold Femtosecond Laser Direct Writing of Precise Metallic Micropatterns on Transparent Substrate

Direct Writing of Semiconducting and Conducting Microstructures by Using Selective Laser Sintering and Reduction of CuO Nanoparticles

Laser Writing of Cu–Ag Alloy Flexible Electrodes with Excellent Oxidation and Electrochemical Migration Resistances

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