2020 IEEE 70th Electronic Components and Technology Conference (ECTC) 2020
DOI: 10.1109/ectc32862.2020.00132
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RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel

Noriyuki Takahashi
1
,
Yuki Susumago
2
,
Sungho Lee
3
et al.
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Cited by 7 publications
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