Recent advance in solder ball interconnections reliability examination

Svecova, Olga; Nicak, Michal; Kosina, Petr; Šandera, Josef

doi:10.1109/isse.2011.6053868

Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) 2011

DOI: 10.1109/isse.2011.6053868

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Recent advance in solder ball interconnections reliability examination

Olga Svecova

Michal Nicak

Petr Kosina

et al.

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Recent advance in solder ball interconnections reliability examination

Cited by 1 publication

References 3 publications

Usage of LTCC technology in electronic packaging

Usage of LTCC technology in electronic packaging

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