2015
DOI: 10.1108/ssmt-10-2014-0018
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Recent advances in mechanical properties of anisotropic conductive adhesive film for microelectronic packaging

Abstract: Purpose -This review paper aims to provide a better understanding of formulation and processing of anisotropic conductive adhesive film (ACF) material and to summarize the significant research and development work for the mechanical properties of ACF material and joints, which helps to the development and application of ACF joints with better reliability in microelectronic packaging systems. Design/methodology/approach -The ACF material was cured at high temperature of 190°C, and the cured ACF was tested by co… Show more

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