Recent Developments in Chemical Mechanical Polishing (CMP) for Precision Manufacturing

Abstract

Advanced developments and applications of Chemical Mechanical Planarization/Polishing (CMP) did by researchers in current decade were discussed in this article. Topics on which this article forms the basis are Abrasives and slurry developments, environment and safety conditions, manufacturing process improvements, modelling and simulations methods for CMP, optimization approaches, reduction of defects in CMP, aid of other manufacturing processes to improve manufacturing performance of CMP. This article expresses several approaches, methods etc. used by various researchers in past ten years from articles published by reputed publishers (IEEE, SPRINGER, ELSEVIER, SEMANTIC SCHOLAR etc.).