Recent Progress on Fabrication and Performance of Polymer Composites with Highly Thermal Conductivity

Abstract

The rise of miniaturized, integrated, and functional electronic devices has intensified the need for heat dissipation. To address this challenge, it is necessary to develop novel thermally conductive polymer composites as packaging materials. In this paper, a number of factors for the construction and design of thermally conductive polymers are concluded. Special attention is focused on the analysis and comparison of the thermally conductive composites prepared by various fillers or strategies to provide guidelines and references for future design of composite materials. The current commonly used preparation strategies of thermally conductive polymer are summarized, such as using a variety of fillers, vacuum filtration, template method, and so on. The challenges of thermally conductive polymer composites are finally sketched. This review can inspire the design of polymer composites with brilliant thermal conductivity.

Enhanced thermal transportation across an electrostatic self-assembly of black phosphorene and boron nitride nanosheets in flexible composite films

“…8,9 One of the most used and effective methods to enhance the thermal conductivity of polymers is the introduction of nanomaterials (for example, metals, ceramics, and carbon materials) with high thermal conductivity. 10,11 Among all the high-thermal-conductivity materials, the hexagonal boron nitride (BN) nanosheet is one of the best candidates for enhancing the thermal conductivity of a polymer matrix owing to its intrinsic high thermal conductivity and excellent electrical insulation. 12,13 Besides, its anisotropic thermal conductivity also facilitates the fabrication of heatspreading films for high-power electronics via aligning the high-aspect-ratio nanosheets to construct oriented thermal transport channels.…”

“…8,9 One of the most used and effective methods to enhance the thermal conductivity of polymers is the introduction of nanomaterials (for example, metals, ceramics, and carbon materials) with high thermal conductivity. 10,11…”

Thermally conductive polymer-based composites: fundamentals, progress and flame retardancy/anti-electromagnetic interference design

“…, 3D stereo packaging technology), electronic devices in the 5G/6G era are moving toward miniaturization, high integration, light weight and high power. 1 Thus, a significant amount of waste heat is generated and accumulated during the operation of electronic devices, exposing the electronic devices to thermal failure and spontaneous combustion risk. 2 In general, heat can be released from electronic devices into the environment mainly through four processes: firstly, heat is transferred inside the devices; secondly, the heat is transferred between the devices and radiators, and then through the radiators; finally, the heat is transferred from the radiators to the ambient environment.…”

Directional Migration and Distribution of Magnetic Microparticles in Polypropylene-Matrix Magnetic Composites Molded by an Injection Molding Assisted by External Magnetic Field

“…The properties of polymer matrix composites consisting of the pure polymer and functional fillers can be adjusted via varying the content and distribution of the fillers [1][2][3][4]. Generally, micro-and/or nano-sizes of organic, inorganic, and metallic granular fillers are added into a pure polymer as functional reinforcement fillers for the fabrication of polymer composites [5].…”