2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) 2023
DOI: 10.1109/epeps58208.2023.10314875
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Recent Progress on Signal Integrity Modeling of Neuromorphic Chips by the PEEC Method

Hanzhi Ma,
Tuomin Tao,
Quankun Chen
et al.
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Cited by 3 publications
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