Recyclable and elastic highly thermally conductive epoxy-based composites with covalent–noncovalent interpenetrating networks
Fubin Luo,
Wenqi Cui,
Yingbing Zou
et al.
Abstract:The high-power electronic architectures and devices require elastic thermally conductive materials. Epoxy resin is limited to be used in thermal management field because of its rigidity. Here, based on epoxy...
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