“…However, various strategies have been applied to reduce the same. Some of the most common methods are moving the antennas with different orientations around the printed circuit board [3,4], use of defected ground structures [5,6], insertion of slots [7], electromagnetic band-gap structures [8][9][10], parasitic elements between the antennas [11], tilting the patch elements along the elevation [12], etc. As discussed in [3,4], best isolation is achieved when the antennas are spaced by the largest available distance on the PCB, but it results in increased size.…”