2006
DOI: 10.1590/s0103-50532006000300016
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Relationship between the dielectric and mechanical properties and the ratio of epoxy resin to hardener of the hybrid thermosetting polymers

Abstract: Foi investigada a relação entre as propriedades dielétricas (constante dielétrica, ε'; fator de perda, ε"; energia de ativação, E a ) e a proporção de resina epóxi (OG) para endurecedor em polímeros termorrígidos de resina epóxi (OG). A amplitude do pico de ε" decresce com o aumento da porcentagem em massa de OG até aproximadamente 73% e aumenta levemente para maiores % OG. A temperatura da posição do pico de ε" aumenta com o aumento da % OG, alcançando valores máximos para formulações no intervalo de 67 a 73%… Show more

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Cited by 43 publications
(23 citation statements)
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“…Materials and Methods: The chemicals were purchased from the following sources: Hybrid Plastics for tetrasilanolPOSS (C 48 H 44 O 14 Si 8 ) (DDSQ‐4OH) disilanolPOSS (C 32 H 74 O 13 Si 8 ) ( i Bu 8 POSS‐2OH) and trisilanolPOSS (C 28 H 66 O 12 Si 7 ) ( i Bu 7 POSS‐3OH); POCH for methanol, 2‐propanol, ethyl acetate and copper acetate hydrate; Merck for dichloromethane (DCM), tetrahydrofuran (THF), diethyl ether, n ‐pentane, benzene, chloroform, [D]chloroform, sodium metal, benzophenone, 1,5‐cyclooctadiene, sodium trimethylsilanolate, chlorosilanes, palladium catalysts [Pd(PPh 3 ) 4 ] and Pd/C (Pd on activated carbon), Pt/C (Pt on activated carbon, Degussa type), [Pt 2 (dvds) 3 ] (Karstedt's catalyst) 2 % xylene solution, platinum and rhodium acetylacetonates, rhodium chloride, calcium hydride, molecular sieves and anhydrous magnesium sulfate, triethylamine and silica gel 60. Silsesquioxane substrates were prepared according to the literature procedures, so too were Pt/SDB, Rh/SDB, Rh/SiO 2 and [RhCl(cod)] 2 . All solvents and alcohols were dried with sodium or CaH 2 prior to use and stored under argon over type 3A molecular sieves.…”
Section: Methodsmentioning
confidence: 99%
“…Materials and Methods: The chemicals were purchased from the following sources: Hybrid Plastics for tetrasilanolPOSS (C 48 H 44 O 14 Si 8 ) (DDSQ‐4OH) disilanolPOSS (C 32 H 74 O 13 Si 8 ) ( i Bu 8 POSS‐2OH) and trisilanolPOSS (C 28 H 66 O 12 Si 7 ) ( i Bu 7 POSS‐3OH); POCH for methanol, 2‐propanol, ethyl acetate and copper acetate hydrate; Merck for dichloromethane (DCM), tetrahydrofuran (THF), diethyl ether, n ‐pentane, benzene, chloroform, [D]chloroform, sodium metal, benzophenone, 1,5‐cyclooctadiene, sodium trimethylsilanolate, chlorosilanes, palladium catalysts [Pd(PPh 3 ) 4 ] and Pd/C (Pd on activated carbon), Pt/C (Pt on activated carbon, Degussa type), [Pt 2 (dvds) 3 ] (Karstedt's catalyst) 2 % xylene solution, platinum and rhodium acetylacetonates, rhodium chloride, calcium hydride, molecular sieves and anhydrous magnesium sulfate, triethylamine and silica gel 60. Silsesquioxane substrates were prepared according to the literature procedures, so too were Pt/SDB, Rh/SDB, Rh/SiO 2 and [RhCl(cod)] 2 . All solvents and alcohols were dried with sodium or CaH 2 prior to use and stored under argon over type 3A molecular sieves.…”
Section: Methodsmentioning
confidence: 99%
“…The rhodium siloxide complex [{Rh(-OSiMe 3 (cod)} 2 ] was synthesized according to the original procedure described by Marciniec et al [31,32]. 1,1,2,2,3,3,4,4-Octafluoropentyl allyl ether was synthesized by the Williamson reaction [33] and octakis (hydridodimethylsiloxy) octasilsesquioxane was prepared according to the procedure described by Caetano et al [29]. Glass plates were purchased from Thermo Scientific.…”
Section: Methodsmentioning
confidence: 99%
“…1 H NMR(300 MHz), 13 C NMR(75 MHz), and 29 Si NMR(59 MHz) spectra were recorded on a Varian XL 300 spectrometer at room temperature using C 6 D 6 as a solvent. Water contact angle was measured using Kruss DSA 100E Drop Shape Analyzer equipped with software-controlled (DAS4 2.0): x, y, z-axis table, quadruple dosing unit, zoom and focus adjustment, illumination, camera with 780 580 px resolution.…”
Section: Methodsmentioning
confidence: 99%
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“…Interest in studies of the relative dielectric permittivity ε and the loss tangent tanδ of polymers is due not only to the importance of these parameters for definite applica tions, but also to the possibility of their usage in studying the features of the molecular mobility of polymer chains. The relaxation processes in poly mers, kinetics of polymerization and linkage, changes of the viscosity and ionic conductivity, and processes at the structure interfaces and phase boundaries in composites were studied in [7][8][9] by applying the DS method.…”
Section: Introductionmentioning
confidence: 99%