2019 IEEE 69th Electronic Components and Technology Conference (ECTC) 2019
DOI: 10.1109/ectc.2019.00076
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Reliability and Benchmark of 2.5D Non-Molding and Molding Technologies

Yu-Hsiang Hsiao
1
,
Yi-Sheng Lin
2
,
Chien-Lin Chang Chien
3
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Cited by 8 publications
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